Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6362090 | Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method | Kyung Wook Paik, Jae-Woong Nah, Young Doo Jeon | 2002-03-26 |
| 6238597 | Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate | Kyung Wook Paik | 2001-05-29 |