| 11831093 |
Socket locator |
Matthew J. Traverso, Joyce Peternel |
2023-11-28 |
$44,893,000 |
| 11784175 |
Integrated circuit bridge for photonics and electrical chip integration |
Matthew J. Traverso, Ashley J. Maker |
2023-10-10 |
$34,136,000 |
| 11762155 |
Photonics packaging platform |
Vipulkumar Patel, Matthew J. Traverso, Aparna R. PRASAD |
2023-09-19 |
$34,503,000 |
| 11756861 |
Thermal packaging with fan out wafer level processing |
Ashley J.M. ERICKSON, Matthew J. Traverso, Joyce Peternel, Aparna R. PRASAD |
2023-09-12 |
$45,547,000 |
| 11391888 |
Wafer-scale fabrication of optical apparatus |
Vipulkumar Patel, Mark A. Webster, Matthew J. Traverso |
2022-07-19 |
$45,888,000 |
| 11373930 |
Thermal packaging with fan out wafer level processing |
Ashley J.M. ERICKSON, Matthew J. Traverso, Joyce Peternel, Aparna R. PRASAD |
2022-06-28 |
$62,593,000 |
| 11226450 |
Periscope optical assembly |
Matthew J. Traverso, Ashley J. Maker |
2022-01-18 |
$82,981,000 |
| 11215775 |
Connection features for electronic and optical packaging |
Ashley J. Maker, Joyce Peternel, Matthew J. Traverso, Aparna R. PRASAD |
2022-01-04 |
$47,502,000 |
| 11181689 |
Low temperature solder in a photonic device |
Vipulkumar Patel, Aparna R. PRASAD |
2021-11-23 |
$70,969,000 |
| 11043478 |
Integrated circuit bridge for photonics and electrical chip integration |
Matthew J. Traverso, Ashley J. Maker |
2021-06-22 |
$54,047,000 |
| 11029475 |
Frame lid for in-package optics |
Vipulkumar Patel, Aparna R. PRASAD |
2021-06-08 |
$88,615,000 |
| 10962719 |
Passive fiber to chip coupling using post-assembly laser patterned waveguides |
Ashley J. Maker, Jock T. Bovington, Matthew J. Traverso |
2021-03-30 |
$43,930,000 |
| 10877219 |
Periscope optical assembly |
Matthew J. Traverso, Ashley J. Maker |
2020-12-29 |
$43,930,000 |
| 10727368 |
Optoelectronic device module having a silicon interposer |
Myung Jin Yim, Seungjae Lee |
2020-07-28 |
$26,273,000 |
| 10564352 |
Photonic integrated circuit bonded with interposer |
Ashley J. Maker, Matthew J. Traverso, Mark A. Webster, Jock T. Bovington |
2020-02-18 |
$36,760,000 |
| 10393959 |
Photonic integrated circuit bonded with interposer |
Ashley J. Maker, Matthew J. Traverso, Mark A. Webster, Jock T. Bovington |
2019-08-27 |
$28,571,000 |
| 10145758 |
Wafer level optical probing structures for silicon photonics |
Matthew J. Traverso, Ravi S. Tummidi, Mark A. Webster |
2018-12-04 |
$48,685,000 |
| 10128225 |
Interconnect structures with polymer core |
Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson |
2018-11-13 |
$26,640,000 |
| 9964719 |
Fan-out wafer level integration for photonic chips |
Vipulkumar Patel, Matthew J. Traverso |
2018-05-08 |
$34,016,000 |
| 9791640 |
Interposer with separable interface |
Terry Patrick Bowen, William Atley Weeks, James R. Toth, Jibin Sun |
2017-10-17 |
$12,288,000 |
| 9613934 |
Interconnect structures with polymer core |
Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson |
2017-04-04 |
$8,141,000 |
| 9504168 |
Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process |
Sivakumar Nagarajan, Nisha Ananthakrishnan, Craig J. Weinman, Kabirkumar Mirpuri |
2016-11-22 |
$9,157,000 |
| 9335494 |
Optoelectronics structures |
Jibin Sun, Haipeng Zhang |
2016-05-10 |
$6,866,000 |
| 9310555 |
Mode size converters and methods of fabricating the same |
Jibin Sun, Haipeng Zhang, Nicola Pugliano |
2016-04-12 |
$10,802,000 |
| 8987918 |
Interconnect structures with polymer core |
Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson |
2015-03-24 |
$15,411,000 |
