Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11831093 | Socket locator | Matthew J. Traverso, Joyce Peternel | 2023-11-28 |
| 11784175 | Integrated circuit bridge for photonics and electrical chip integration | Matthew J. Traverso, Ashley J. Maker | 2023-10-10 |
| 11762155 | Photonics packaging platform | Vipulkumar Patel, Matthew J. Traverso, Aparna R. PRASAD | 2023-09-19 |
| 11756861 | Thermal packaging with fan out wafer level processing | Ashley J.M. ERICKSON, Matthew J. Traverso, Joyce Peternel, Aparna R. PRASAD | 2023-09-12 |
| 11391888 | Wafer-scale fabrication of optical apparatus | Vipulkumar Patel, Mark A. Webster, Matthew J. Traverso | 2022-07-19 |
| 11373930 | Thermal packaging with fan out wafer level processing | Ashley J.M. ERICKSON, Matthew J. Traverso, Joyce Peternel, Aparna R. PRASAD | 2022-06-28 |
| 11226450 | Periscope optical assembly | Matthew J. Traverso, Ashley J. Maker | 2022-01-18 |
| 11215775 | Connection features for electronic and optical packaging | Ashley J. Maker, Joyce Peternel, Matthew J. Traverso, Aparna R. PRASAD | 2022-01-04 |
| 11181689 | Low temperature solder in a photonic device | Vipulkumar Patel, Aparna R. PRASAD | 2021-11-23 |
| 11043478 | Integrated circuit bridge for photonics and electrical chip integration | Matthew J. Traverso, Ashley J. Maker | 2021-06-22 |
| 11029475 | Frame lid for in-package optics | Vipulkumar Patel, Aparna R. PRASAD | 2021-06-08 |
| 10962719 | Passive fiber to chip coupling using post-assembly laser patterned waveguides | Ashley J. Maker, Jock T. Bovington, Matthew J. Traverso | 2021-03-30 |
| 10877219 | Periscope optical assembly | Matthew J. Traverso, Ashley J. Maker | 2020-12-29 |
| 10727368 | Optoelectronic device module having a silicon interposer | Myung Jin Yim, Seungjae Lee | 2020-07-28 |
| 10564352 | Photonic integrated circuit bonded with interposer | Ashley J. Maker, Matthew J. Traverso, Mark A. Webster, Jock T. Bovington | 2020-02-18 |
| 10393959 | Photonic integrated circuit bonded with interposer | Ashley J. Maker, Matthew J. Traverso, Mark A. Webster, Jock T. Bovington | 2019-08-27 |
| 10145758 | Wafer level optical probing structures for silicon photonics | Matthew J. Traverso, Ravi S. Tummidi, Mark A. Webster | 2018-12-04 |
| 10128225 | Interconnect structures with polymer core | Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson | 2018-11-13 |
| 9964719 | Fan-out wafer level integration for photonic chips | Vipulkumar Patel, Matthew J. Traverso | 2018-05-08 |
| 9791640 | Interposer with separable interface | Terry Patrick Bowen, William Atley Weeks, James R. Toth, Jibin Sun | 2017-10-17 |
| 9613934 | Interconnect structures with polymer core | Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson | 2017-04-04 |
| 9504168 | Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process | Sivakumar Nagarajan, Nisha Ananthakrishnan, Craig J. Weinman, Kabirkumar Mirpuri | 2016-11-22 |
| 9335494 | Optoelectronics structures | Jibin Sun, Haipeng Zhang | 2016-05-10 |
| 9310555 | Mode size converters and methods of fabricating the same | Jibin Sun, Haipeng Zhang, Nicola Pugliano | 2016-04-12 |
| 8987918 | Interconnect structures with polymer core | Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson | 2015-03-24 |