Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11762155 | Photonics packaging platform | Vipulkumar Patel, Matthew J. Traverso, Sandeep Razdan | 2023-09-19 |
| 11756861 | Thermal packaging with fan out wafer level processing | Ashley J.M. ERICKSON, Matthew J. Traverso, Sandeep Razdan, Joyce Peternel | 2023-09-12 |
| 11391897 | Stiffener device providing external connections to co-packaged optical devices | Vipulkumar Patel, Paul Ton, Norbert SCHLEPPLE | 2022-07-19 |
| 11373930 | Thermal packaging with fan out wafer level processing | Ashley J.M. ERICKSON, Matthew J. Traverso, Sandeep Razdan, Joyce Peternel | 2022-06-28 |
| 11353668 | Packaging with substrate and printed circuit board cutouts | Ashley J.M. ERICKSON, Vipulkumar Patel | 2022-06-07 |
| 11215775 | Connection features for electronic and optical packaging | Ashley J. Maker, Joyce Peternel, Sandeep Razdan, Matthew J. Traverso | 2022-01-04 |
| 11181689 | Low temperature solder in a photonic device | Sandeep Razdan, Vipulkumar Patel | 2021-11-23 |
| 11029475 | Frame lid for in-package optics | Vipulkumar Patel, Sandeep Razdan | 2021-06-08 |