Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8895365 | Techniques and configurations for surface treatment of an integrated circuit substrate | Suriyakala Ramalingam, Rajen S. Sidhu, Nisha Ananthakrishnan, Sivakumar Nagarajan, Wei Tan +1 more | 2014-11-25 |
| 8377550 | Flip chip package containing novel underfill materials | Rajasekaran Swaminathan, Hong Dong, Nisha Ananthakrisnan, Rahul N. Manepalli | 2013-02-19 |
| 8143339 | Nanocomposite polymers | Steven B. Warner, Prabir K. Patra | 2012-03-27 |