NA

Nisha Ananthakrisnan

IN Intel: 1 patents #18,218 of 30,777Top 60%
Overall (All Time): #3,147,862 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8377550 Flip chip package containing novel underfill materials Rajasekaran Swaminathan, Hong Dong, Sandeep Razdan, Rahul N. Manepalli 2013-02-19