Issued Patents All Time
Showing 25 most recent of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12416093 | Electroless plating process | Chandrasekharan Nair, Darko Grujicic, Rengarajan Shanmugam, Srinivasan Raman, Roy Dittler +3 more | 2025-09-16 |
| 12341117 | Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates | Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han +4 more | 2025-06-24 |
| 12327773 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2025-06-10 |
| 12308329 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo | 2025-05-20 |
| 12300620 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Debendra Mallik, Robert L. Sankman | 2025-05-13 |
| 12243825 | Hybrid conductive vias for electronic substrates | Srinivas V. Pietambaram | 2025-03-04 |
| 12218040 | Nested interposer with through-silicon via bridge die | Srinivas V. Pietambaram, Debendra Mallik, Kristof Darmawikarta, Ravindranath V. Mahajan | 2025-02-04 |
| 12159825 | Dielectric-to-metal adhesion promotion material | Suddhasattwa Nad, Marcel Wall, Darko Grujicic | 2024-12-03 |
| 12148704 | Electrical interconnect bridge | Srinivas V. Pietambaram | 2024-11-19 |
| 12125793 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Gang Duan | 2024-10-22 |
| 12087700 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne | 2024-09-10 |
| 12087695 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Gang Duan | 2024-09-10 |
| 12068172 | Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages | Tarek A. Ibrahim, Wei-Lun Kane Jen, Steve Cho, Jason M. Gamba, Javier Soto Gonzalez | 2024-08-20 |
| 11990427 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo | 2024-05-21 |
| 11978685 | Glass core patch with in situ fabricated fan-out layer to enable die tiling applications | Srinivas V. Pietambaram, Robert L. Sankman, Gang Duan, Debendra Mallik | 2024-05-07 |
| 11973041 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo | 2024-04-30 |
| 11955448 | Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches | Jung Kyu Han, Hongxia Feng, Xiaoying Guo | 2024-04-09 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2024-03-19 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more | 2024-03-05 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more | 2024-03-05 |
| 11901248 | Embedded die architecture and method of making | Robert L. Sankman, Robert Alan May, Srinivas V. Pietambaram, Bharat P. Penmecha | 2024-02-13 |
| 11862619 | Patch accommodating embedded dies having different thicknesses | Srinivas V. Pietambaram, Robert Alan May, Kristof Darmawikarta, Hiroki Tanaka, Sri Ranga Sai Boyapati | 2024-01-02 |
| 11810859 | Multi-layered adhesion promotion films | Srinivas V. Pietambaram, Cemil Geyik, Kemal Aygun | 2023-11-07 |
| 11798887 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Debendra Mallik, Robert L. Sankman | 2023-10-24 |
| 11791269 | Electrical interconnect bridge | Srinivas V. Pietambaram | 2023-10-17 |