| 12476214 |
Solder interconnect hierarchy for heterogeneous electronic device packaging |
Yunhua Deng, Jung Kyu Han, Li He, Gang Duan |
2025-11-18 |
|
| 12416093 |
Electroless plating process |
Chandrasekharan Nair, Darko Grujicic, Rengarajan Shanmugam, Srinivasan Raman, Roy Dittler +3 more |
2025-09-16 |
|
| 12341117 |
Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates |
Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han +4 more |
2025-06-24 |
|
| 12327773 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more |
2025-06-10 |
|
| 12308329 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo |
2025-05-20 |
|
| 12300620 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Debendra Mallik, Robert L. Sankman |
2025-05-13 |
|
| 12243825 |
Hybrid conductive vias for electronic substrates |
Srinivas V. Pietambaram |
2025-03-04 |
|
| 12218040 |
Nested interposer with through-silicon via bridge die |
Srinivas V. Pietambaram, Debendra Mallik, Kristof Darmawikarta, Ravindranath V. Mahajan |
2025-02-04 |
|
| 12159825 |
Dielectric-to-metal adhesion promotion material |
Suddhasattwa Nad, Marcel Wall, Darko Grujicic |
2024-12-03 |
$28,395,000 |
| 12148704 |
Electrical interconnect bridge |
Srinivas V. Pietambaram |
2024-11-19 |
$25,575,000 |
| 12125793 |
Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications |
Srinivas V. Pietambaram, Gang Duan |
2024-10-22 |
$18,859,000 |
| 12087700 |
Embedded die microelectronic device with molded component |
Srinivas V. Pietambaram, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne |
2024-09-10 |
$16,964,000 |
| 12087695 |
Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications |
Srinivas V. Pietambaram, Gang Duan |
2024-09-10 |
$16,964,000 |
| 12068172 |
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages |
Tarek A. Ibrahim, Wei-Lun Kane Jen, Steve Cho, Jason M. Gamba, Javier Soto Gonzalez |
2024-08-20 |
$20,163,000 |
| 11990427 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo |
2024-05-21 |
$18,840,000 |
| 11978685 |
Glass core patch with in situ fabricated fan-out layer to enable die tiling applications |
Srinivas V. Pietambaram, Robert L. Sankman, Gang Duan, Debendra Mallik |
2024-05-07 |
$26,756,000 |
| 11973041 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo |
2024-04-30 |
$26,151,000 |
| 11955448 |
Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches |
Jung Kyu Han, Hongxia Feng, Xiaoying Guo |
2024-04-09 |
$27,197,000 |
| 11935805 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more |
2024-03-19 |
$28,784,000 |
| 11923312 |
Patternable die attach materials and processes for patterning |
Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more |
2024-03-05 |
$29,696,000 |
| 11923307 |
Microelectronic structures including bridges |
Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more |
2024-03-05 |
$29,696,000 |
| 11901248 |
Embedded die architecture and method of making |
Robert L. Sankman, Robert Alan May, Srinivas V. Pietambaram, Bharat P. Penmecha |
2024-02-13 |
$18,546,000 |
| 11862619 |
Patch accommodating embedded dies having different thicknesses |
Srinivas V. Pietambaram, Robert Alan May, Kristof Darmawikarta, Hiroki Tanaka, Sri Ranga Sai Boyapati |
2024-01-02 |
$30,016,000 |
| 11810859 |
Multi-layered adhesion promotion films |
Srinivas V. Pietambaram, Cemil Geyik, Kemal Aygun |
2023-11-07 |
$22,371,000 |
| 11798887 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Debendra Mallik, Robert L. Sankman |
2023-10-24 |
$20,059,000 |
