| 12416093 |
Electroless plating process |
Chandrasekharan Nair, Darko Grujicic, Rengarajan Shanmugam, Srinivasan Raman, Roy Dittler +3 more |
2025-09-16 |
| 12349282 |
Capacitors in through glass vias |
Benjamin Duong, Aleksandar Aleksov, Helme A. CASTRO DE LA TORRE, Kristof Darmawikarta, Darko Grujicic +5 more |
2025-07-01 |
| 12159825 |
Dielectric-to-metal adhesion promotion material |
Rahul N. Manepalli, Suddhasattwa Nad, Darko Grujicic |
2024-12-03 |
| 12057252 |
Electronic substrates having embedded inductors |
Benjamin Duong, Michael Garelick, Darko Grujicic, Tarek A. Ibrahim, Brandon C. Marin +1 more |
2024-08-06 |
| 12033930 |
Selectively roughened copper architectures for low insertion loss conductive features |
Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more |
2024-07-09 |
| 11694898 |
Hybrid fine line spacing architecture for bump pitch scaling |
Suddhasattwa Nad, Jeremy Ecton, Bai Nie, Rahul N. Manepalli |
2023-07-04 |
| 11501967 |
Selective metal deposition by patterning direct electroless metal plating |
Suddhasattwa Nad, Roy Dittler, Darko Grujicic, Rahul N. Manepalli |
2022-11-15 |
| 11445616 |
Interfacial layer for high resolution lithography (HRL) and high speed input/output (IO or I/O) architectures |
Suddhasattwa Nad, Rahul N. Manepalli |
2022-09-13 |
| 11291122 |
Apparatus with a substrate provided with plasma treatment |
Darko Grujicic, Rengarajan Shanmugam, Sandeep Gaan, Adrian BAYRAKTAROGLU, Roy Dittler +4 more |
2022-03-29 |
| 11177232 |
Circuit device with monolayer bonding between surface structures |
Suddhasattwa Nad, Rahul N. Manepalli |
2021-11-16 |
| 11177234 |
Package architecture with improved via drill process and method for forming such package |
Suddhasattwa Nad, Rahul N. Manepalli |
2021-11-16 |
| 10658281 |
Integrated circuit substrate and method of making |
Rahul N. Manepalli, Kousik Ganesan, Srinivas V. Pietambaram |
2020-05-19 |