Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Selective metal deposition by patterning direct electroless metal plating

Selective metal deposition by patterning direct electroless metal plating

US Patent 11501967 · Granted Nov 15, 2022

Estimated economic value: $16,955,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substrates having adhesion promotor layers and related methods2025
Glass substrates having transverse capacitors for use with semiconductor package2025
Glass substrates having transverse capacitors for use with semiconductor package2025
Glass substrates having transverse capacitors for use with semiconductor package2025
Solder interconnect hierarchy for heterogeneous electronic device packaging2025
Electroless plating process2025
Electroless plating process2025
Electroless plating process2025
Electroless plating process2025
Microelectronic assemblies including interconnects with different solder materia2025
Agitation monitoring system for plating process2025
Capacitors in through glass vias2025