Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun +6 more | 2025-09-09 |
| 12349282 | Capacitors in through glass vias | Benjamin Duong, Aleksandar Aleksov, Helme A. CASTRO DE LA TORRE, Kristof Darmawikarta, Darko Grujicic +5 more | 2025-07-01 |
| 12255147 | Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein | Jeremy Ecton, Brandon C. Marin, Srinivas V. Pietambaram | 2025-03-18 |
| 12224103 | Angled inductor with small form factor | Brandon C. Marin, Jeremy Ecton, Matthew Tingey, Ravindranath V. Mahajan, Srinivas V. Pietambaram | 2025-02-11 |
| 12159825 | Dielectric-to-metal adhesion promotion material | Rahul N. Manepalli, Marcel Wall, Darko Grujicic | 2024-12-03 |
| 12074102 | Structural elements for application specific electronic device packages | Ravindranath V. Mahajan, Brandon C. Marin, Jeremy Ecton, Mohammad Mamunur Rahman | 2024-08-27 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Jeremy Ecton, Hongxia Feng, Tarek A. Ibrahim +9 more | 2024-07-09 |
| 12027466 | Conductive route patterning for electronic substrates | Jeremy Ecton, Aleksandar Aleksov, Brandon C. Marin, Yonggang Li, Leonel Arana +2 more | 2024-07-02 |
| 12002745 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more | 2024-06-04 |
| 11948848 | Subtractive etch resolution implementing a functional thin metal resist | Jeremy Ecton, Oscar Ojeda, Leonel Arana, Robert Alan May, Hiroki Tanaka +1 more | 2024-04-02 |
| 11942334 | Microelectronic assemblies having conductive structures with different thicknesses | Jeremy Ecton, Aleksandar Aleksov, Kristof Darmawikarta, Vahidreza Parichehreh, Veronica Strong +1 more | 2024-03-26 |
| 11817349 | Conductive route patterning for electronic substrates | Jeremy Ecton, Brandon C. Marin, Leonel Arana, Matthew Tingey, Oscar Ojeda +3 more | 2023-11-14 |
| 11721650 | Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package | Brandon C. Marin, Aleksandar Aleksov, Georgios Dogiamis, Jeremy Ecton, Mohammad Mamunur Rahman | 2023-08-08 |
| 11694898 | Hybrid fine line spacing architecture for bump pitch scaling | Jeremy Ecton, Bai Nie, Rahul N. Manepalli, Marcel Wall | 2023-07-04 |
| 11658055 | Customizable release layers to enable low warpage architectures for advanced packaging applications | Rahul N. Manepalli | 2023-05-23 |
| 11574993 | Package architecture with tunable magnetic properties for embedded devices | Rengarajan Shanmugam, Darko Grujicic, Srinivas V. Pietambaram | 2023-02-07 |
| 11528811 | Method, device and system for providing etched metallization structures | Jeremy Ecton, Nicholas S. Haehn, Oscar Ojeda, Arnab Roy, Timothy A. White +1 more | 2022-12-13 |
| 11501967 | Selective metal deposition by patterning direct electroless metal plating | Roy Dittler, Darko Grujicic, Marcel Wall, Rahul N. Manepalli | 2022-11-15 |
| 11445616 | Interfacial layer for high resolution lithography (HRL) and high speed input/output (IO or I/O) architectures | Rahul N. Manepalli, Marcel Wall | 2022-09-13 |
| 11404389 | In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages | Jeremy Ecton, Kristof Darmawikarta, Yonggang Li, Xiaoying Guo | 2022-08-02 |
| 11291122 | Apparatus with a substrate provided with plasma treatment | Darko Grujicic, Rengarajan Shanmugam, Sandeep Gaan, Adrian BAYRAKTAROGLU, Roy Dittler +4 more | 2022-03-29 |
| 11257748 | Semiconductor package having polymeric interlayer disposed between conductive elements and dielectric layer | Rahul N. Manepalli | 2022-02-22 |
| 11227825 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman +6 more | 2022-01-18 |
| 11177232 | Circuit device with monolayer bonding between surface structures | Rahul N. Manepalli, Marcel Wall | 2021-11-16 |
| 11177234 | Package architecture with improved via drill process and method for forming such package | Rahul N. Manepalli, Marcel Wall | 2021-11-16 |