Issued Patents All Time
Showing 1–25 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun +6 more | 2025-09-09 |
| 12396613 | Steam cleaning apparatus | Fariha AHMED, Joshua Redman, Peter Hutchinson, Dmitry Layevsky, Andrew D. Keene +14 more | 2025-08-26 |
| 12354931 | Optimization for raster scanning | Vinith BEJUGAM, Kristof Darmawikarta, Samuel T. George, Srinivas V. Pietambaram | 2025-07-08 |
| 12345932 | Die last and waveguide last architecture for silicon photonic packaging | Bai Nie, Pooya Tadayon, Leonel Arana, Changhua Liu, Kristof Darmawikarta +4 more | 2025-07-01 |
| 12327749 | Carrier chuck and methods of forming and using thereof | Deniz TURAN, Yosef KORNBLUTH | 2025-06-10 |
| 12307982 | Method and device for driving a display panel and display device | Chuansheng Song, Weiwei Pan, Wenxing LI, Mingwei GE, Xiujian ZHU | 2025-05-20 |
| 12230430 | Substrate embedded magnetic core inductors and method of making | Srinivas V. Pietambaram, Kristof Darmawikarta, Gang Duan, Sameer Paital | 2025-02-18 |
| 12152196 | Continuous solid organic matter pyrolysis polygeneration system and method for using same | Hongyu Si, Bing Wang, Xiaohui Liang, Suxiang Liu, Meirong XU +8 more | 2024-11-26 |
| 12106718 | Driving method and driving device for a display panel, and display device | Wangwang He, Weiwei Pan | 2024-10-01 |
| 12027466 | Conductive route patterning for electronic substrates | Jeremy Ecton, Aleksandar Aleksov, Brandon C. Marin, Leonel Arana, Suddhasattwa Nad +2 more | 2024-07-02 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more | 2024-03-05 |
| 11806957 | Light guide film product processing apparatus | Yong Liu | 2023-11-07 |
| 11728265 | Selective deposition of embedded thin-film resistors for semiconductor packaging | Brandon C. Marin, Frank Truong, Shivasubramanian Balasubramanian, Dilan Seneviratne, Sameer Paital +4 more | 2023-08-15 |
| 11605867 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Jeremy Ecton, Aleksandar Aleksov, Kristof Darmawikarta, Dilan Seneviratne | 2023-03-14 |
| 11404389 | In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages | Jeremy Ecton, Suddhasattwa Nad, Kristof Darmawikarta, Xiaoying Guo | 2022-08-02 |
| 11348718 | Substrate embedded magnetic core inductors and method of making | Srinivas V. Pietambaram, Kristof Darmawikarta, Gang Duan, Sameer Paital | 2022-05-31 |
| 11081768 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Jeremy Ecton, Aleksandar Aleksov, Kristof Darmawikarta, Dilan Seneviratne | 2021-08-03 |
| 10985080 | Electronic package that includes lamination layer | Pramod Malatkar, Kyle Yazzie, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne +3 more | 2021-04-20 |
| 10910327 | Electronic device package with reduced thickness variation | Brandon C. Marin, Vahidreza Parichehreh, Jeremy Ecton | 2021-02-02 |
| 10672701 | Thin electronic package elements using laser spallation | Vivek Raghunathan, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan | 2020-06-02 |
| 10586715 | Embedded circuit patterning feature selective electroless | Aritra Dhar, Dilan Seneviratne, Jon M. Williams | 2020-03-10 |
| 10539294 | Automobile exterior rear view mirror blind spot warning indication device | Norbert Kürschner, Daniel Fritz, Yifei Feng, Weiping Lu | 2020-01-21 |
| 10306760 | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method | Islam A. Salama, Charan Gurumurthy, Hamid Azimi | 2019-05-28 |
| 10290557 | Selective metallization of an integrated circuit (IC) substrate | Brandon C. Marin, Trina Ghosh Dastidar, Dilan Seneviratne, Sirisha Chava | 2019-05-14 |
| 9820390 | Process for forming a semiconductor device substrate | Mihir K. Roy, Islam A. Salama | 2017-11-14 |