| 12327801 |
Robust mold integrated substrate |
Jimin Yao, Shawna M. Liff |
2025-06-10 |
| 11327050 |
Mechanical failure monitoring, detection, and classification in electronic assemblies |
Rajesh Kumar Neerukatti, Naga Sivakumar Yagnamurthy, David C. McCoy, Pramod Malatkar, Frank P. Prieto |
2022-05-10 |
| 11322455 |
Robust mold integrated substrate |
Jimin Yao, Shawna M. Liff |
2022-05-03 |
| 11322456 |
Die back side structures for warpage control |
Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Je-Young Chang +2 more |
2022-05-03 |
| 11022792 |
Coupling a magnet with a MEMS device |
Anna M. Prakash, Suriyakala Ramalingam, Liwei Wang, Robert Starkston, Arnab Choudhury +3 more |
2021-06-01 |
| 10998275 |
Package with cathodic protection for corrosion mitigation |
Mohit Mamodia |
2021-05-04 |
| 10985080 |
Electronic package that includes lamination layer |
Pramod Malatkar, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne, Praneeth Akkinepally +3 more |
2021-04-20 |
| 10957656 |
Integrated circuit packages with patterned protective material |
Naga Sivakumar Yagnamurthy, Pramod Malatkar, Chia-Pin Chiu, Mohit Mamodia, Mark Gallina +3 more |
2021-03-23 |
| 10499461 |
Thermal head with a thermal barrier for integrated circuit die processing |
Mohit Mamodia, Dingying Xu, Kuang Liu, Paul Diglio, Pramod Malatkar |
2019-12-03 |
| 10290569 |
Constrained cure component attach process for improved IC package warpage control |
Venkata Suresh R. Guthikonda, Patrick Nardi, Santosh Sankarasubramanian, Kevin Y. Lin, Leigh M. TRIBOLET +2 more |
2019-05-14 |
| 10278318 |
Method of assembling an electronic component using a probe having a fluid thereon |
Pramod Malatkar, Xiao Lu, Daniel Chavez-Clemente |
2019-04-30 |
| 10049987 |
Enhanced fiducial visibility and recognition |
Chia-Pin Chiu |
2018-08-14 |
| 9661745 |
Vacuum lamination of depth-sensing camera module PCB to stiffener using built-in vacuum channels |
Pramod Malatkar |
2017-05-23 |