Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327801 | Robust mold integrated substrate | Jimin Yao, Shawna M. Liff | 2025-06-10 |
| 11327050 | Mechanical failure monitoring, detection, and classification in electronic assemblies | Rajesh Kumar Neerukatti, Naga Sivakumar Yagnamurthy, David C. McCoy, Pramod Malatkar, Frank P. Prieto | 2022-05-10 |
| 11322455 | Robust mold integrated substrate | Jimin Yao, Shawna M. Liff | 2022-05-03 |
| 11322456 | Die back side structures for warpage control | Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Je-Young Chang +2 more | 2022-05-03 |
| 11022792 | Coupling a magnet with a MEMS device | Anna M. Prakash, Suriyakala Ramalingam, Liwei Wang, Robert Starkston, Arnab Choudhury +3 more | 2021-06-01 |
| 10998275 | Package with cathodic protection for corrosion mitigation | Mohit Mamodia | 2021-05-04 |
| 10985080 | Electronic package that includes lamination layer | Pramod Malatkar, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne, Praneeth Akkinepally +3 more | 2021-04-20 |
| 10957656 | Integrated circuit packages with patterned protective material | Naga Sivakumar Yagnamurthy, Pramod Malatkar, Chia-Pin Chiu, Mohit Mamodia, Mark Gallina +3 more | 2021-03-23 |
| 10499461 | Thermal head with a thermal barrier for integrated circuit die processing | Mohit Mamodia, Dingying Xu, Kuang Liu, Paul Diglio, Pramod Malatkar | 2019-12-03 |
| 10290569 | Constrained cure component attach process for improved IC package warpage control | Venkata Suresh R. Guthikonda, Patrick Nardi, Santosh Sankarasubramanian, Kevin Y. Lin, Leigh M. TRIBOLET +2 more | 2019-05-14 |
| 10278318 | Method of assembling an electronic component using a probe having a fluid thereon | Pramod Malatkar, Xiao Lu, Daniel Chavez-Clemente | 2019-04-30 |
| 10049987 | Enhanced fiducial visibility and recognition | Chia-Pin Chiu | 2018-08-14 |
| 9661745 | Vacuum lamination of depth-sensing camera module PCB to stiffener using built-in vacuum channels | Pramod Malatkar | 2017-05-23 |