Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676873 | Semiconductor package having sealant bridge | Dinesh Padmanabhan Ramalekshmi Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Yonghao An, Marco Aurelio Cartas Ayala +2 more | 2023-06-13 |
| 11322456 | Die back side structures for warpage control | Feras Eid, Shankar Devasenathipathy, Chandra Mohan Jha, Je-Young Chang, Kyle Yazzie +2 more | 2022-05-03 |
| 10290569 | Constrained cure component attach process for improved IC package warpage control | Kyle Yazzie, Patrick Nardi, Santosh Sankarasubramanian, Kevin Y. Lin, Leigh M. TRIBOLET +2 more | 2019-05-14 |