Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804428 | Mixed pad size and pad design | Wen Yin, Manuel Aldrete | 2023-10-31 |
| 11676873 | Semiconductor package having sealant bridge | Dinesh Padmanabhan Ramalekshmi Thanu, Hemanth K. Dhavaleswarapu, Venkata Suresh R. Guthikonda, John J. Beatty, Marco Aurelio Cartas Ayala +2 more | 2023-06-13 |
| 11545411 | Package comprising wire bonds configured as a heat spreader | Wen Yin, Reynante Tamunan Alvarado | 2023-01-03 |
| 11189575 | Specialized surface mount device for symmetric heat distribution in package | Supatta Niramarnkarn, Bin Xu, Wen Yin | 2021-11-30 |