Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676873 | Semiconductor package having sealant bridge | Hemanth K. Dhavaleswarapu, Venkata Suresh R. Guthikonda, John J. Beatty, Yonghao An, Marco Aurelio Cartas Ayala +2 more | 2023-06-13 |
| 11328979 | Substrate integrated posts and heat spreader customization for enhanced package thermomechanics | Feras Eid, Sergio Antonio Chan Arguedas, Johanna M. Swan, John J. Beatty | 2022-05-10 |