John J. Beatty — 14 Patents at Intel

John J. Beatty has been granted 14 US patents while listed as an inventor at Intel. The first was granted in 2007 and the most recent in October 2023. John J. Beatty ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list John J. Beatty in Chandler, AZ, US.

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11776869	Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense	Feras Eid, Johanna M. Swan, Sergio Antonio Chan Arguedas	2023-10-03	$24,984,000
11676873	Semiconductor package having sealant bridge	Dinesh Padmanabhan Ramalekshmi Thanu, Hemanth K. Dhavaleswarapu, Venkata Suresh R. Guthikonda, Yonghao An, Marco Aurelio Cartas Ayala +2 more	2023-06-13	$22,204,000
11652061	Package-level backside metallization (BSM)	Shenavia S. Howell, Raymond A. Krick, Suzana Prstic	2023-05-16	$11,130,000
11652018	Heat spreader edge standoffs for managing bondline thickness in microelectronic packages	Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, Syadwad Jain, Nachiket R. Raravikar	2023-05-16	$11,130,000
11328978	Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense	Feras Eid, Johanna M. Swan, Sergio Antonio Chan Arguedas	2022-05-10	$19,182,000
11328979	Substrate integrated posts and heat spreader customization for enhanced package thermomechanics	Feras Eid, Dinesh Padmanabhan Ramalekshmi Thanu, Sergio Antonio Chan Arguedas, Johanna M. Swan	2022-05-10	$19,182,000
11062970	Heat spreader edge standoffs for managing bondline thickness in microelectronic packages	Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, Syadwad Jain, Nachiket R. Raravikar	2021-07-13	$34,958,000
10643938	Standoff spacers for managing bondline thickness in microelectronic packages	Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, Sachin Deshmukh	2020-05-05	$29,615,000
10290592	Semiconductor package, and a method for forming a semiconductor package	Suzana Prstic, Vipul V. Mehta	2019-05-14	$24,469,000
9806002	Multi-reference integrated heat spreader (IHS) solution	Arnab Choudhury, Prakriti Choudhary	2017-10-31	$13,240,000
8709869	Method of manufacturing a plurality of electronic assemblies	Jason Garcia	2014-04-29	$15,282,000
7421778	Method of making an electronic assembly	Jason Garcia	2008-09-09	$18,766,000
7183493	Electronic assembly having multi-material interconnects	Jason Garcia	2007-02-27	$10,067,000
7179093	Retractable ledge socket	Nicholas Holmberg, Pramod Malatkar	2007-02-20	$9,940,000

John J. Beatty — 14 Patents

Issued Patents All Time

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