Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776869 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Feras Eid, Johanna M. Swan, Sergio Antonio Chan Arguedas | 2023-10-03 |
| 11676873 | Semiconductor package having sealant bridge | Dinesh Padmanabhan Ramalekshmi Thanu, Hemanth K. Dhavaleswarapu, Venkata Suresh R. Guthikonda, Yonghao An, Marco Aurelio Cartas Ayala +2 more | 2023-06-13 |
| 11652061 | Package-level backside metallization (BSM) | Shenavia S. Howell, Raymond A. Krick, Suzana Prstic | 2023-05-16 |
| 11652018 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, Syadwad Jain, Nachiket R. Raravikar | 2023-05-16 |
| 11328978 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Feras Eid, Johanna M. Swan, Sergio Antonio Chan Arguedas | 2022-05-10 |
| 11328979 | Substrate integrated posts and heat spreader customization for enhanced package thermomechanics | Feras Eid, Dinesh Padmanabhan Ramalekshmi Thanu, Sergio Antonio Chan Arguedas, Johanna M. Swan | 2022-05-10 |
| 11062970 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, Syadwad Jain, Nachiket R. Raravikar | 2021-07-13 |
| 10643938 | Standoff spacers for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, Sachin Deshmukh | 2020-05-05 |
| 10290592 | Semiconductor package, and a method for forming a semiconductor package | Suzana Prstic, Vipul V. Mehta | 2019-05-14 |
| 9806002 | Multi-reference integrated heat spreader (IHS) solution | Arnab Choudhury, Prakriti Choudhary | 2017-10-31 |
| 8709869 | Method of manufacturing a plurality of electronic assemblies | Jason Garcia | 2014-04-29 |
| 7421778 | Method of making an electronic assembly | Jason Garcia | 2008-09-09 |
| 7183493 | Electronic assembly having multi-material interconnects | Jason Garcia | 2007-02-27 |
| 7179093 | Retractable ledge socket | Nicholas Holmberg, Pramod Malatkar | 2007-02-20 |