Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652018 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Nachiket R. Raravikar | 2023-05-16 |
| 11062970 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Nachiket R. Raravikar | 2021-07-13 |
| 10969840 | Heat spreaders with interlocked inserts | Aravindha R. Antoniswamy, Zhizhong Tang, Wei Hu | 2021-04-06 |
| 10763188 | Integrated heat spreader having electromagnetically-formed features | Aravindha R. Antoniswamy, Thomas J. Fitzgerald, Kumaran Murugesan Chakravarthy, Wei Hu, Zhizhong Tang | 2020-09-01 |
| 10651108 | Foam composite | Zhizhong Tang, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu, Carl Deppisch +3 more | 2020-05-12 |
| 10580717 | Multiple-chip package with multiple thermal interface materials | Boxi LIU, Hemanth K. Dhavaleswarapu, James C. Matayabas, Jr. | 2020-03-03 |
| 10056314 | Polymer thermal interface material having enhanced thermal conductivity | Randall D. Lowe, Jr., James C. Matayabas, Jr. | 2018-08-21 |
| 9070660 | Polymer thermal interface material having enhanced thermal conductivity | Randall D. Lowe, Jr., James C. Matayabas, Jr. | 2015-06-30 |
| 8896110 | Paste thermal interface materials | Wei Hu, Zhizhong Tang, Rajen S. Sidhu | 2014-11-25 |
| 8866290 | Molded heat spreaders | Zhizhong Tang, Paul R. Start | 2014-10-21 |