| 11652018 |
Heat spreader edge standoffs for managing bondline thickness in microelectronic packages |
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2023-05-16 |
| 11062970 |
Heat spreader edge standoffs for managing bondline thickness in microelectronic packages |
Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Nachiket R. Raravikar |
2021-07-13 |
| 10969840 |
Heat spreaders with interlocked inserts |
Aravindha R. Antoniswamy, Zhizhong Tang, Wei Hu |
2021-04-06 |
| 10763188 |
Integrated heat spreader having electromagnetically-formed features |
Aravindha R. Antoniswamy, Thomas J. Fitzgerald, Kumaran Murugesan Chakravarthy, Wei Hu, Zhizhong Tang |
2020-09-01 |
| 10651108 |
Foam composite |
Zhizhong Tang, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu, Carl Deppisch +3 more |
2020-05-12 |
| 10580717 |
Multiple-chip package with multiple thermal interface materials |
Boxi LIU, Hemanth K. Dhavaleswarapu, James C. Matayabas, Jr. |
2020-03-03 |
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Polymer thermal interface material having enhanced thermal conductivity |
Randall D. Lowe, Jr., James C. Matayabas, Jr. |
2018-08-21 |
| 9070660 |
Polymer thermal interface material having enhanced thermal conductivity |
Randall D. Lowe, Jr., James C. Matayabas, Jr. |
2015-06-30 |
| 8896110 |
Paste thermal interface materials |
Wei Hu, Zhizhong Tang, Rajen S. Sidhu |
2014-11-25 |
| 8866290 |
Molded heat spreaders |
Zhizhong Tang, Paul R. Start |
2014-10-21 |