| 11916003 |
Varied ball ball-grid-array (BGA) packages |
Xiao Lu, Jiongxin Lu, Christopher Combs, Alexander HUETTIS, John Harper +5 more |
2024-02-27 |
$28,450,000 |
| 10651108 |
Foam composite |
Zhizhong Tang, Syadwad Jain, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu +3 more |
2020-05-12 |
$29,489,000 |
| 10049971 |
Package structure to enhance yield of TMI interconnections |
Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more |
2018-08-14 |
$20,895,000 |
| 9808875 |
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby |
Deepak Kulkarni, Leonel Arana, Gregory S. Constable, Sriram Srinivasan |
2017-11-07 |
$13,901,000 |
| 9613933 |
Package structure to enhance yield of TMI interconnections |
Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more |
2017-04-04 |
$8,141,000 |
| 9330999 |
Multi-component integrated heat spreader for multi-chip packages |
Thomas J. Fitzgerald, Aravindha R. Antoniswamy, Nikunj P. Patel |
2016-05-03 |
$11,131,000 |
| 9254532 |
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby |
Deepak Kulkarni, Leonel Arana, Gregory S. Constable, Sriram Srinivasan |
2016-02-09 |
$15,927,000 |
| 9257405 |
Multi-solder techniques and configurations for integrated circuit package assembly |
Rajen S. Sidhu, Wei Hu, Martha A. Dudek |
2016-02-09 |
$15,927,000 |
| 8809181 |
Multi-solder techniques and configurations for integrated circuit package assembly |
Rajen S. Sidhu, Wei Hu, Martha A. Dudek |
2014-08-19 |
$23,268,000 |
| 8550327 |
Clad solder thermal interface material |
Rajasekaran Swaminathan |
2013-10-08 |
$14,378,000 |
| 8409929 |
Forming a semiconductor package including a thermal interface material |
Mukul Renavikar, Daewoong Suh, Abhishek Gupta |
2013-04-02 |
$10,070,000 |
| 8242602 |
Composite solder TIM for electronic package |
Tom Fitzgerald, Fay Hua |
2012-08-14 |
$13,822,000 |
| 8174113 |
Methods of fabricating robust integrated heat spreader designs and structures formed thereby |
Abhishek Gupta, Mike Boyd, Jinlin Wang, Daewoong Suh, Brad Drew |
2012-05-08 |
$29,842,000 |
| 8030757 |
Forming a semiconductor package including a thermal interface material |
Mukul Renavikar, Daewoong Suh, Abhishek Gupta |
2011-10-04 |
$13,316,000 |
| 7955900 |
Coated thermal interface in integrated circuit die |
Susheel Jadhav |
2011-06-07 |
$16,749,000 |
| 7821126 |
Heat sink with preattached thermal interface material and method of making same |
Sabina J. Houle |
2010-10-26 |
$15,337,000 |
| 7816250 |
Composite solder TIM for electronic package |
Tom Fitzgerald, Fay Hua |
2010-10-19 |
$13,567,000 |
| 7727815 |
Reactive gettering in phase change solders to inhibit oxidation at contact surfaces |
Chad A. Kumaus, Daewoong Suh, Ashay Dani |
2010-06-01 |
$13,475,000 |
| 7704798 |
Electronic assemblies with hot spot cooling and methods relating thereto |
Fay Hua, Joni G. Hansen, Youzhi E. Xu |
2010-04-27 |
$12,857,000 |
| 7672132 |
Electronic packaging apparatus and method |
Thomas J. Fitzgerald, Manjit Dhindsa, Mark Norwil, Matthew J. Schaenzer |
2010-03-02 |
$14,883,000 |
| 7494041 |
In-situ alloyed solders, articles made thereby, and processes of making same |
Edward L. Martin, Tiffany Byrne |
2009-02-24 |
$15,365,000 |
| 7489033 |
Electronic assembly with hot spot cooling |
Fay Hua, Joni G. Hansen, Youzhi E. Xu |
2009-02-10 |
$24,393,000 |
| 7439617 |
Capillary underflow integral heat spreader |
Tom Fitzgerald, Fay Hua, Wei Shi, Mike Gasparek |
2008-10-21 |
$17,085,000 |
| 7436058 |
Reactive solder material |
Fay Hua, Krista J. Whittenburg |
2008-10-14 |
$13,671,000 |
| 7416922 |
Heat sink with preattached thermal interface material and method of making same |
Sabina J. Houle |
2008-08-26 |
$24,347,000 |
