Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11916003 | Varied ball ball-grid-array (BGA) packages | Xiao Lu, Jiongxin Lu, Christopher Combs, Alexander HUETTIS, John Harper +5 more | 2024-02-27 |
| 10651108 | Foam composite | Zhizhong Tang, Syadwad Jain, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu +3 more | 2020-05-12 |
| 10049971 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2018-08-14 |
| 9808875 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Deepak Kulkarni, Leonel Arana, Gregory S. Constable, Sriram Srinivasan | 2017-11-07 |
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2017-04-04 |
| 9330999 | Multi-component integrated heat spreader for multi-chip packages | Thomas J. Fitzgerald, Aravindha R. Antoniswamy, Nikunj P. Patel | 2016-05-03 |
| 9254532 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Deepak Kulkarni, Leonel Arana, Gregory S. Constable, Sriram Srinivasan | 2016-02-09 |
| 9257405 | Multi-solder techniques and configurations for integrated circuit package assembly | Rajen S. Sidhu, Wei Hu, Martha A. Dudek | 2016-02-09 |
| 8809181 | Multi-solder techniques and configurations for integrated circuit package assembly | Rajen S. Sidhu, Wei Hu, Martha A. Dudek | 2014-08-19 |
| 8550327 | Clad solder thermal interface material | Rajasekaran Swaminathan | 2013-10-08 |
| 8409929 | Forming a semiconductor package including a thermal interface material | Mukul Renavikar, Daewoong Suh, Abhishek Gupta | 2013-04-02 |
| 8242602 | Composite solder TIM for electronic package | Tom Fitzgerald, Fay Hua | 2012-08-14 |
| 8174113 | Methods of fabricating robust integrated heat spreader designs and structures formed thereby | Abhishek Gupta, Mike Boyd, Jinlin Wang, Daewoong Suh, Brad Drew | 2012-05-08 |
| 8030757 | Forming a semiconductor package including a thermal interface material | Mukul Renavikar, Daewoong Suh, Abhishek Gupta | 2011-10-04 |
| 7955900 | Coated thermal interface in integrated circuit die | Susheel Jadhav | 2011-06-07 |
| 7821126 | Heat sink with preattached thermal interface material and method of making same | Sabina J. Houle | 2010-10-26 |
| 7816250 | Composite solder TIM for electronic package | Tom Fitzgerald, Fay Hua | 2010-10-19 |
| 7727815 | Reactive gettering in phase change solders to inhibit oxidation at contact surfaces | Chad A. Kumaus, Daewoong Suh, Ashay Dani | 2010-06-01 |
| 7704798 | Electronic assemblies with hot spot cooling and methods relating thereto | Fay Hua, Joni G. Hansen, Youzhi E. Xu | 2010-04-27 |
| 7672132 | Electronic packaging apparatus and method | Thomas J. Fitzgerald, Manjit Dhindsa, Mark Norwil, Matthew J. Schaenzer | 2010-03-02 |
| 7494041 | In-situ alloyed solders, articles made thereby, and processes of making same | Edward L. Martin, Tiffany Byrne | 2009-02-24 |
| 7489033 | Electronic assembly with hot spot cooling | Fay Hua, Joni G. Hansen, Youzhi E. Xu | 2009-02-10 |
| 7439617 | Capillary underflow integral heat spreader | Tom Fitzgerald, Fay Hua, Wei Shi, Mike Gasparek | 2008-10-21 |
| 7436058 | Reactive solder material | Fay Hua, Krista J. Whittenburg | 2008-10-14 |
| 7416922 | Heat sink with preattached thermal interface material and method of making same | Sabina J. Houle | 2008-08-26 |