Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8174113 | Methods of fabricating robust integrated heat spreader designs and structures formed thereby | Abhishek Gupta, Mike Boyd, Carl Deppisch, Jinlin Wang, Daewoong Suh | 2012-05-08 |