Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266608 | Integrated photonics and processor package with redistribution layer and EMIB connector | Kenneth M. Brown, David Chak Wang Hui, Ling Liao, Syed S. Islam | 2025-04-01 |
| 11894474 | Silicon photonic integrated lens compatible with wafer processing | Priyanka Dobriyal, Ankur Agrawal, Quan Tran, Raghuram Narayan, Raiyomand Aspandiar +2 more | 2024-02-06 |
| 11715928 | Decoupling layer to reduce underfill stress in semiconductor devices | Priyanka Dobriyal, Ankur Agrawal, Quan Tran, Raiyomand Aspandiar, Kenneth M. Brown | 2023-08-01 |
| 8733620 | Solder deposition and thermal processing of thin-die thermal interface material | Mukul Renavikar | 2014-05-27 |
| 7955900 | Coated thermal interface in integrated circuit die | Carl Deppisch | 2011-06-07 |
| 7553702 | Integrating a heat spreader with an interface material having reduced void size | Thomas J. Fitzgerald, Mukul Renavikar | 2009-06-30 |
| 7534715 | Methods including fluxless chip attach processes | Daoqiang Lu, Nitin A. Deshpande | 2009-05-19 |
| 7485495 | Integrated heat spreader with intermetallic layer and method for making | Mukul Renavikar | 2009-02-03 |
| 7239517 | Integrated heat spreader and method for using | Thomas J. Fitzgerald, Mukul Renavikar | 2007-07-03 |
| 7220622 | Method for attaching a semiconductor die to a substrate and heat spreader | Daoqiang Lu | 2007-05-22 |
| 7183641 | Integrated heat spreader with intermetallic layer and method for making | Mukul Renavikar | 2007-02-27 |
| 7164585 | Thermal interface apparatus, systems, and methods | Carl Deppisch, Fay Hua | 2007-01-16 |