Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237442 | Photonic package laser area macro-void pressure relief micro-channels | Ankur Agarwal | 2025-02-25 |
| 11894474 | Silicon photonic integrated lens compatible with wafer processing | Ankur Agrawal, Susheel Jadhav, Quan Tran, Raghuram Narayan, Raiyomand Aspandiar +2 more | 2024-02-06 |
| 11715928 | Decoupling layer to reduce underfill stress in semiconductor devices | Susheel Jadhav, Ankur Agrawal, Quan Tran, Raiyomand Aspandiar, Kenneth M. Brown | 2023-08-01 |
| 10356912 | Apparatus and method for conformal coating of integrated circuit packages | Suriyakala Ramalingam, Chester C. Lee, Raiyomand Aspandiar | 2019-07-16 |