| 12332477 |
Methods and apparatus to reduce stress on lasers in optical transceivers |
Aditi Mallik, Pengyue Wen, Wendai Wang, Xiaozhong Wang |
2025-06-17 |
| 12015446 |
Optical transceivers with multi-laser modules |
Saeed Fathololoumi, Ling Liao |
2024-06-18 |
| 11973539 |
Optical transceivers with multi-laser modules |
Saeed Fathololoumi, Ling Liao |
2024-04-30 |
| 11894474 |
Silicon photonic integrated lens compatible with wafer processing |
Priyanka Dobriyal, Ankur Agrawal, Susheel Jadhav, Raghuram Narayan, Raiyomand Aspandiar +2 more |
2024-02-06 |
| 11715928 |
Decoupling layer to reduce underfill stress in semiconductor devices |
Priyanka Dobriyal, Susheel Jadhav, Ankur Agrawal, Raiyomand Aspandiar, Kenneth M. Brown |
2023-08-01 |
| 10070524 |
Method of making glass core substrate for integrated circuit devices |
Qing Ma, Robert L. Sankman, Johanna M. Swan, Valluri Rao |
2018-09-04 |
| 9686861 |
Glass core substrate for integrated circuit devices and methods of making the same |
Qing Ma, Robert L. Sankman, Johanna M. Swan, Valluri Rao |
2017-06-20 |
| 8264941 |
Arrangement and method to perform scanning readout of ferroelectric bit charges |
Byong-man Kim, Robert Stark, Nathan Franklin, Qing Ma, Valluri Rao +3 more |
2012-09-11 |
| 8207453 |
Glass core substrate for integrated circuit devices and methods of making the same |
Qing Ma, Robert L. Sankman, Johanna M. Swan, Valluri Rao |
2012-06-26 |
| 7782649 |
Using controlled bias voltage for data retention enhancement in a ferroelectric media |
Valluri Rao, Qing Ma |
2010-08-24 |
| 7602261 |
Micro-electromechanical system (MEMS) switch |
Tsung-Kuan A. Chou |
2009-10-13 |
| 7510907 |
Through-wafer vias and surface metallization for coupling thereto |
John Heck, Qing Ma, Tsung-Kuan A. Chou, Semeon Altshuler, Boaz Weinfeld |
2009-03-31 |
| 7321275 |
Ultra-low voltage capable zipper switch |
Tsung-Kuan A. Chou, Hanan Bar, Joseph Melki, John Heck, Qing Ma |
2008-01-22 |
| 7214995 |
Mechanism to prevent actuation charging in microelectromechanical actuators |
Tsung-Kuan A. Chou |
2007-05-08 |
| 6967548 |
Microelectromechanical (MEMS) switching apparatus |
Qing Ma, Valluri Rao, John Heck, Li-Peng Wang, Dong-sik Shim |
2005-11-22 |
| 6914335 |
Semiconductor device having a low-K dielectric layer |
Ebrahim Andideh, Qing Ma, Steve Towle |
2005-07-05 |
| 6903452 |
Packaging microelectromechanical structures |
Qing Ma, Valluri Rao, Li-Peng Wang, John Heck |
2005-06-07 |
| 6812814 |
Microelectromechanical (MEMS) switching apparatus |
Qing Ma, Valluri Rao, John Heck, Li-Peng Wang, Dong-sik Shim |
2004-11-02 |
| 6809617 |
Edge plated transmission line and switch integrally formed therewith |
Qing Ma, Joseph Hayden, Tsung-Kuan A. Chou |
2004-10-26 |
| 6794223 |
Structure and process for reducing die corner and edge stresses in microelectronic packages |
Qing Ma, Jim Maveety |
2004-09-21 |
| 6686820 |
Microelectromechanical (MEMS) switching apparatus |
Qing Ma, Valluri Rao, John Heck, Li-Peng Wang, Dong-sik Shim |
2004-02-03 |
| 6673697 |
Packaging microelectromechanical structures |
Qing Ma, Valluri Rao, Li-Peng Wang, John Heck |
2004-01-06 |
| 6617682 |
Structure for reducing die corner and edge stresses in microelectronic packages |
Qing Ma, Jim Maveety |
2003-09-09 |
| 6509622 |
Integrated circuit guard ring structures |
Qing Ma, Jin Lee, Harry Fujimoto |
2003-01-21 |
| 6362091 |
Method for making a semiconductor device having a low-k dielectric layer |
Ebrahim Andideh, Qing Ma, Steve Towle |
2002-03-26 |