Issued Patents All Time
Showing 1–25 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854894 | Integrated circuit device structures and double-sided electrical testing | Patrick Morrow, Rishabh Mehandru, Doug B. Ingerly, Kimin Jun, Kevin P. O'Brien +3 more | 2023-12-26 |
| 11532601 | Group III-N transistors for system on chip (SOC) architecture integrating power management and radio frequency circuits | Han Wui Then, Robert S. Chau, Niloy Mukherjee, Marko Radosavljevic, Ravi Pillarisetty +2 more | 2022-12-20 |
| 11222863 | Techniques for die stacking and associated configurations | Fay Hua, Christopher M. Pelto, Mark Bohr, Johanna M. Swan | 2022-01-11 |
| 10943836 | Gallium nitride NMOS on Si (111) co-integrated with a silicon PMOS | Marko Radosavljevic, Sansaptak Dasgupta, Han Wui Then | 2021-03-09 |
| 10872820 | Integrated circuit structures | Bruce A. Block, Patrick Morrow, Rishabh Mehandru, Doug B. Ingerly, Kimin Jun +3 more | 2020-12-22 |
| 10763248 | Multi-layer silicon/gallium nitride semiconductor | Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Ravi Pillarisetty, Kimin Jun +3 more | 2020-09-01 |
| 10707136 | Gallium nitride NMOS on Si (111) co-integrated with a silicon PMOS | Marko Radosavljevic, Sansaptak Dasgupta, Han Wui Then | 2020-07-07 |
| 10658312 | Embedded millimeter-wave phased array module | Telesphor Kamgaing, Adel A. Elsherbini | 2020-05-19 |
| 10615133 | Die package with superposer substrate for passive components | Telesphor Kamgaing | 2020-04-07 |
| 10600787 | Silicon PMOS with gallium nitride NMOS for voltage regulation | Sansaptak Dasgupta, Han Wui Then, Marko Radosavljevic, Peter G. Tolchinsky, Roza Kotlyar | 2020-03-24 |
| 10453679 | Methods and devices integrating III-N transistor circuitry with Si transistor circuitry | Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Ravi Pillarisetty, Kimin Jun +3 more | 2019-10-22 |
| 10290614 | Group III-N transistors for system on chip (SOC) architecture integrating power management and radio frequency circuits | Han Wui Then, Robert S. Chau, Niloy Mukherjee, Marko Radosavljevic, Ravi Pillarisetty +2 more | 2019-05-14 |
| 10256286 | Integrated inductor for integrated circuit devices | Andreas Duevel, Telesphor Kamgaing, Uwe Zillmann | 2019-04-09 |
| 10134727 | High breakdown voltage III-N depletion mode MOS capacitors | Han Wui Then, Sansaptak Dasgupta, Gerhard Schrom, Robert S. Chau | 2018-11-20 |
| 9881990 | Integrated inductor for integrated circuit devices | Andreas Duevel, Telesphor Kamgaing, Uwe Zillmann | 2018-01-30 |
| 9773742 | Embedded millimeter-wave phased array module | Telesphor Kamgaing, Adel A. Elsherbini | 2017-09-26 |
| 9673268 | Integrated inductor for integrated circuit devices | Andreas Duevel, Telesphor Kamgaing, Uwe Zillmann | 2017-06-06 |
| 9653805 | Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates | Telesphor Kamgaing, Georgios Palaskas | 2017-05-16 |
| 9419339 | Package structures including discrete antennas assembled on a device | Telesphor Kamgaing, Ofir Degani | 2016-08-16 |
| 9297824 | Techniques, systems and devices related to acceleration measurement | Qing Ma, Feras Eid, Kevin Lin, Weng Hong Teh, Johanna M. Swan +1 more | 2016-03-29 |
| 9229466 | Fully integrated voltage regulators for multi-stack integrated circuit architectures | Ruchir Saraswat, Andre Schaefer, Uwe Zillman, Andreas Duevel, Telesphor Kamgaing +1 more | 2016-01-05 |
| 9166284 | Package structures including discrete antennas assembled on a device | Telesphor Kamgaing, Ofir Degani | 2015-10-20 |
| 9064709 | High breakdown voltage III-N depletion mode MOS capacitors | Han Wui Then, Sansaptak Dasgupta, Gerhard Schrom, Robert S. Chau | 2015-06-23 |
| 8816906 | Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates | Telesphor Kamgaing, Yorgos Palaskas | 2014-08-26 |
| 8759950 | Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same | Telesphor Kamgaing | 2014-06-24 |