Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074087 | Thermal interface material layer and use thereof | — | 2024-08-27 |
| 11282633 | Device with out-plane inductors | Sidharth Dalmia, Zhichao Zhang | 2022-03-22 |
| 11222863 | Techniques for die stacking and associated configurations | Christopher M. Pelto, Valluri Rao, Mark Bohr, Johanna M. Swan | 2022-01-11 |
| 10777538 | System on package architecture including structures on die back side | Telesphor Kamgaing, Johanna M. Swan | 2020-09-15 |
| 10734236 | Electronic devices with components formed by late binding using self-assembled monolayers | Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan | 2020-08-04 |
| 10697065 | Sam assisted selective e-less plating on packaging materials | Aranzazu MAESTRE CARO | 2020-06-30 |
| 10595410 | Non-planar on-package via capacitor | Brandon M. Rawlings, Georgios Dogiamis, Telesphor Kamgaing | 2020-03-17 |
| 10321573 | Solder contacts for socket assemblies | Hong Xie, Gregorio R. Murtagian, Amit Abraham, Alan McAllister, Ting Zhong | 2019-06-11 |
| 10304686 | Electronic devices with components formed by late binding using self-assembled monolayers | Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan | 2019-05-28 |
| 10304804 | System on package architecture including structures on die back side | Telesphor Kamgaing, Johanna M. Swan | 2019-05-28 |
| 9860988 | Solder contacts for socket assemblies | Hong Xie, Gregorio R. Murtagian, Amit Abraham, Alan McAllister, Ting Zhong | 2018-01-02 |
| 9824962 | Local dense patch for board assembly utilizing laser structuring metallization process | Adel A. Elsherbini | 2017-11-21 |
| 9406582 | Apparatus to minimize thermal impedance using copper on die backside | Gregory M. Chrysler, James G. Maveety, Kramadhati V. Ravi | 2016-08-02 |
| 8441118 | Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages | — | 2013-05-14 |
| 8242602 | Composite solder TIM for electronic package | Tom Fitzgerald, Carl Deppisch | 2012-08-14 |
| 7960831 | Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same | Albert Wu, Kevin Jeng, Krishna Seshan | 2011-06-14 |
| 7886813 | Thermal interface material with carbon nanotubes and particles | James G. Maveety | 2011-02-15 |
| 7816250 | Composite solder TIM for electronic package | Tom Fitzgerald, Carl Deppisch | 2010-10-19 |
| 7776651 | Method for compensating for CTE mismatch using phase change lead-free super plastic solders | — | 2010-08-17 |
| 7704798 | Electronic assemblies with hot spot cooling and methods relating thereto | Carl Deppisch, Joni G. Hansen, Youzhi E. Xu | 2010-04-27 |
| 7615476 | Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages | — | 2009-11-10 |
| 7560373 | Low temperature solder metallurgy and process for packaging applications and structures formed thereby | — | 2009-07-14 |
| 7524351 | Nano-sized metals and alloys, and methods of assembling packages containing same | C. Garner | 2009-04-28 |
| 7524754 | Interconnect shunt used for current distribution and reliability redundancy | Mark Bohr, Jun He, Dustin P. Wood | 2009-04-28 |
| 7489033 | Electronic assembly with hot spot cooling | Carl Deppisch, Joni G. Hansen, Youzhi E. Xu | 2009-02-10 |