| 12074087 |
Thermal interface material layer and use thereof |
— |
2024-08-27 |
|
| 11282633 |
Device with out-plane inductors |
Sidharth Dalmia, Zhichao Zhang |
2022-03-22 |
$16,833,000 |
| 11222863 |
Techniques for die stacking and associated configurations |
Christopher M. Pelto, Valluri Rao, Mark Bohr, Johanna M. Swan |
2022-01-11 |
$33,310,000 |
| 10777538 |
System on package architecture including structures on die back side |
Telesphor Kamgaing, Johanna M. Swan |
2020-09-15 |
$34,212,000 |
| 10734236 |
Electronic devices with components formed by late binding using self-assembled monolayers |
Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan |
2020-08-04 |
$32,661,000 |
| 10697065 |
Sam assisted selective e-less plating on packaging materials |
Aranzazu MAESTRE CARO |
2020-06-30 |
$33,333,000 |
| 10595410 |
Non-planar on-package via capacitor |
Brandon M. Rawlings, Georgios Dogiamis, Telesphor Kamgaing |
2020-03-17 |
$21,927,000 |
| 10321573 |
Solder contacts for socket assemblies |
Hong Xie, Gregorio R. Murtagian, Amit Abraham, Alan McAllister, Ting Zhong |
2019-06-11 |
$16,707,000 |
| 10304686 |
Electronic devices with components formed by late binding using self-assembled monolayers |
Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan |
2019-05-28 |
$17,387,000 |
| 10304804 |
System on package architecture including structures on die back side |
Telesphor Kamgaing, Johanna M. Swan |
2019-05-28 |
$17,387,000 |
| 9860988 |
Solder contacts for socket assemblies |
Hong Xie, Gregorio R. Murtagian, Amit Abraham, Alan McAllister, Ting Zhong |
2018-01-02 |
$11,729,000 |
| 9824962 |
Local dense patch for board assembly utilizing laser structuring metallization process |
Adel A. Elsherbini |
2017-11-21 |
$11,290,000 |
| 9406582 |
Apparatus to minimize thermal impedance using copper on die backside |
Gregory M. Chrysler, James G. Maveety, Kramadhati V. Ravi |
2016-08-02 |
$8,723,000 |
| 8441118 |
Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages |
— |
2013-05-14 |
$17,697,000 |
| 8242602 |
Composite solder TIM for electronic package |
Tom Fitzgerald, Carl Deppisch |
2012-08-14 |
$13,822,000 |
| 7960831 |
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same |
Albert Wu, Kevin Jeng, Krishna Seshan |
2011-06-14 |
$17,389,000 |
| 7886813 |
Thermal interface material with carbon nanotubes and particles |
James G. Maveety |
2011-02-15 |
$18,725,000 |
| 7816250 |
Composite solder TIM for electronic package |
Tom Fitzgerald, Carl Deppisch |
2010-10-19 |
$13,567,000 |
| 7776651 |
Method for compensating for CTE mismatch using phase change lead-free super plastic solders |
— |
2010-08-17 |
$11,574,000 |
| 7704798 |
Electronic assemblies with hot spot cooling and methods relating thereto |
Carl Deppisch, Joni G. Hansen, Youzhi E. Xu |
2010-04-27 |
$12,857,000 |
| 7615476 |
Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages |
— |
2009-11-10 |
$23,460,000 |
| 7560373 |
Low temperature solder metallurgy and process for packaging applications and structures formed thereby |
— |
2009-07-14 |
|
| 7524351 |
Nano-sized metals and alloys, and methods of assembling packages containing same |
C. Garner |
2009-04-28 |
$19,079,000 |
| 7524754 |
Interconnect shunt used for current distribution and reliability redundancy |
Mark Bohr, Jun He, Dustin P. Wood |
2009-04-28 |
$19,079,000 |
| 7489033 |
Electronic assembly with hot spot cooling |
Carl Deppisch, Joni G. Hansen, Youzhi E. Xu |
2009-02-10 |
$24,393,000 |
