Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7960831 | Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same | Fay Hua, Albert Wu, Krishna Seshan | 2011-06-14 | $17,389,000 |
| 7314819 | Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same | Fay Hua, Albert Wu, Krishna Seshan | 2008-01-01 | |
| 7056817 | Forming a cap above a metal layer | Krishna Seshan, Haiping Dun | 2006-06-06 | $10,284,000 |
| 6265300 | Wire bonding surface and bonding method | Ameet Bhansali, Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen +2 more | 2001-07-24 | $166,417,000 |
| 5567981 | Bonding pad structure having an interposed rigid layer | Ameet Bhansali, Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen +2 more | 1996-10-22 | $116,160,000 |