Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6265300 | Wire bonding surface and bonding method | Ameet Bhansali, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen, Nicholas P. Mencinger +2 more | 2001-07-24 | $166,417,000 |
| 5567981 | Bonding pad structure having an interposed rigid layer | Ameet Bhansali, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen, Nicholas P. Mencinger +2 more | 1996-10-22 | $116,160,000 |
| 4869966 | Encapsulated assemblage and method of making | David J. St. Clair, Richard L. Danforth | 1989-09-26 | |
| 4749430 | Method of making an encapsulated assemblage | David J. St. Clair, Richard L. Danforth | 1988-06-07 | |
| 4692557 | Encapsulated solar cell assemblage and method of making | David J. St. Clair | 1987-09-08 |