Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6265300 | Wire bonding surface and bonding method | Ameet Bhansali, Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Nicholas P. Mencinger +2 more | 2001-07-24 |
| 5567981 | Bonding pad structure having an interposed rigid layer | Ameet Bhansali, Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Nicholas P. Mencinger +2 more | 1996-10-22 |
| 5183494 | Process for manufacturing rare earth-iron-boron permanent magnet alloy powders | Ti Y. Liu, Chi-Jui Chen | 1993-02-02 |
| 4927664 | Process for applying electrically insulative layers | Chong-Shien Tsai, Bean T. Li, King L. Jean | 1990-05-22 |