Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6265300 | Wire bonding surface and bonding method | Ameet Bhansali, Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen +2 more | 2001-07-24 |
| 5567981 | Bonding pad structure having an interposed rigid layer | Ameet Bhansali, Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen +2 more | 1996-10-22 |