Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6265300 | Wire bonding surface and bonding method | Ameet Bhansali, Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen +2 more | 2001-07-24 | $166,417,000 |
| 5567981 | Bonding pad structure having an interposed rigid layer | Ameet Bhansali, Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen +2 more | 1996-10-22 | $116,160,000 |