Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6265300 | Wire bonding surface and bonding method | Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen, Nicholas P. Mencinger +2 more | 2001-07-24 |
| 5893725 | C4 substrate contact pad which has a layer of NI-B plating | — | 1999-04-13 |
| 5886406 | Power-ground plane for a C4 flip-chip substrate | — | 1999-03-23 |
| 5842626 | Method for coupling surface mounted capacitors to semiconductor packages | Rama Shukla | 1998-12-01 |
| 5786630 | Multi-layer C4 flip-chip substrate | Qing Zhu | 1998-07-28 |
| 5757071 | C4 substrate contact pad which has a layer of Ni-B plating | — | 1998-05-26 |
| 5708296 | Power-ground plane for a C4 flip-chip substrate | — | 1998-01-13 |
| 5567981 | Bonding pad structure having an interposed rigid layer | Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen, Nicholas P. Mencinger +2 more | 1996-10-22 |