| 7960831 |
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same |
Fay Hua, Albert Wu, Kevin Jeng |
2011-06-14 |
$17,389,000 |
| 7511370 |
Power gridding scheme |
— |
2009-03-31 |
$17,039,000 |
| 7425458 |
Selectable decoupling capacitors for integrated circuits and associated methods |
— |
2008-09-16 |
$30,165,000 |
| 7411269 |
Isolation structure configurations for modifying stresses in semiconductor devices |
Qing Ma, Jin Lee, Harry Fujimoto, Changhong Dai, Shiuh-Wuu Lee +1 more |
2008-08-12 |
$20,410,000 |
| 7410858 |
Isolation structure configurations for modifying stresses in semiconductor devices |
Qing Ma, Jin Lee, Harry Fujimoto, Changhong Dai, Shiuh-Wuu Lee +1 more |
2008-08-12 |
$20,410,000 |
| 7314819 |
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same |
Fay Hua, Albert Wu, Kevin Jeng |
2008-01-01 |
|
| 7262070 |
Method to make a weight compensating/tuning layer on a substrate |
Theodore Doros |
2007-08-28 |
$16,981,000 |
| 7250333 |
Method of fabricating a linearized output driver and terminator |
Sanjay Dabral |
2007-07-31 |
$23,850,000 |
| 7202568 |
Semiconductor passivation deposition process for interfacial adhesion |
M. Lawrence A. Dass, Geoffrey Bakker |
2007-04-10 |
$13,767,000 |
| 7056817 |
Forming a cap above a metal layer |
Kevin Jeng, Haiping Dun |
2006-06-06 |
$10,284,000 |
| 7034402 |
Device with segmented ball limiting metallurgy |
— |
2006-04-25 |
$12,896,000 |
| 7033923 |
Method of forming segmented ball limiting metallurgy |
— |
2006-04-25 |
$12,896,000 |
| 7012304 |
Diode and transistor design for high speed I/O |
Sanjay Dabral |
2006-03-14 |
$16,541,000 |
| 6979896 |
Power gridding scheme |
— |
2005-12-27 |
$17,238,000 |
| 6937458 |
Selectable decoupling capacitors for integrated circuit and methods of use |
— |
2005-08-30 |
$19,986,000 |
| 6930379 |
Power gridding scheme |
— |
2005-08-16 |
$26,624,000 |
| 6914658 |
Method for fabricating a moat around an active pixel area of a microelectronic image projection device |
Chaoyang Li, Geoffery L. Bakker, Lawrence Dass |
2005-07-05 |
$31,328,000 |
| 6876053 |
Isolation structure configurations for modifying stresses in semiconductor devices |
Qing Ma, Jin Lee, Harry Fujimoto, Changhong Dai, Shiuh-Wuu Lee +1 more |
2005-04-05 |
$32,622,000 |
| 6734544 |
Integrated circuit package |
Soupin Yan |
2004-05-11 |
$33,328,000 |
| 6715663 |
Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method |
Kuljeet Singh |
2004-04-06 |
$23,009,000 |
| 6686659 |
Selectable decoupling capacitors for integrated circuit and methods of use |
— |
2004-02-03 |
$41,560,000 |
| 6646324 |
Method and apparatus for a linearized output driver and terminator |
Sanjay Dabral |
2003-11-11 |
$43,556,000 |
| 6614118 |
Structures to mechanically stabilize isolated top-level metal lines |
Eric B. Selvin |
2003-09-02 |
$46,907,000 |
| 6577502 |
Mobile computer having a housing with openings for cooling |
Eric Distefano |
2003-06-10 |
$73,878,000 |
| 6552425 |
Integrated circuit package |
Soupin Yan |
2003-04-22 |
$53,837,000 |
