Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming segmented ball limiting metallurgy

Method of forming segmented ball limiting metallurgy

US Patent 7033923 · Granted Apr 25, 2006

Estimated economic value: $12,896,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ball-limiting metallurgies, solder bump compositions used therewith, packages as2011
Power gridding scheme2009
Selectable decoupling capacitors for integrated circuits and associated methods2008
Isolation structure configurations for modifying stresses in semiconductor devic2008
Isolation structure configurations for modifying stresses in semiconductor devic2008
Ball-limiting metallurgies, solder bump compositions used therewith, packages as2008
Method to make a weight compensating/tuning layer on a substrate2007
Method of fabricating a linearized output driver and terminator2007
Semiconductor passivation deposition process for interfacial adhesion2007
Forming a cap above a metal layer2006
Device with segmented ball limiting metallurgy2006
Diode and transistor design for high speed I/O2006