| 12494468 |
3D system and wafer reconstitution with mid-layer interposer |
SivaChandra Jangam |
2025-12-09 |
|
| 12469765 |
Thermally enhanced chip-on-wafer or wafer-on-wafer bonding |
Jinshu LU, Kui Hu, Jun Zhai |
2025-11-11 |
|
| 12451436 |
Interconnecting a plurality of dies having spare input/output circuit |
Jun Zhai |
2025-10-21 |
|
| 12424455 |
Seal ring designs supporting efficient die to die routing |
Chi Nung Ni, Long Huang, SivaChandra Jangam |
2025-09-23 |
|
| 12322730 |
Wafer reconstitution and die-stitching |
Jun Zhai, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran |
2025-06-03 |
|
| 12261132 |
Structure and method for sealing a silicon IC |
Vidhya Ramachandran, SivaChandra Jangam, Jun Zhai, Kunzhong Hu |
2025-03-25 |
|
| 12237269 |
Scalable large system based on organic interconnect |
Ravindranath Kollipara |
2025-02-25 |
|
| 12176803 |
Decoupling device using stored charge reverse recovery |
Chi Nung Ni |
2024-12-24 |
$240,476,000 |
| 12159835 |
High density 3D interconnect configuration |
Zhitao Cao, Kunzhong Hu, Jun Zhai |
2024-12-03 |
$369,762,000 |
| 12119304 |
Very fine pitch and wiring density organic side by side chiplet integration |
Zhitao Cao, Kunzhong Hu |
2024-10-15 |
$249,534,000 |
| 12087689 |
Selectable monolithic or external scalable die-to-die interconnection system methodology |
Jun Zhai, Jung-Cheng Yeh, Kunzhong Hu, Raymundo M. Camenforte, Thomas Hoffmann |
2024-09-10 |
$233,602,000 |
| 12021035 |
Interconnecting dies by stitch routing |
Jun Zhai |
2024-06-25 |
$209,077,000 |
| 11862557 |
Selectable monolithic or external scalable die-to-die interconnection system methodology |
Jun Zhai, Jung-Cheng Yeh, Kunzhong Hu, Raymundo M. Camenforte, Thomas Hoffmann |
2024-01-02 |
$111,466,000 |
| 11862481 |
Seal ring designs supporting efficient die to die routing |
Chi Nung Ni, Long Huang, SivaChandra Jangam |
2024-01-02 |
$111,466,000 |
| 11831312 |
Systems and methods for implementing a scalable system |
Bahattin Kilic, Jie Zhao, Kunzhong Hu, Suk-Kyu Ryu |
2023-11-28 |
$171,025,000 |
| 11824015 |
Structure and method for sealing a silicon IC |
Vidhya Ramachandran, SivaChandra Jangam, Jun Zhai, Kunzhong Hu |
2023-11-21 |
$128,924,000 |
| 11811303 |
Decoupling device using stored charge reverse recovery |
Chi Nung Ni |
2023-11-07 |
$200,618,000 |
| 11735567 |
Wafer reconstitution and die-stitching |
Jun Zhai, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran |
2023-08-22 |
$159,607,000 |
| 11735526 |
High density 3D interconnect configuration |
Zhitao Cao, Kunzhong Hu, Jun Zhai |
2023-08-22 |
$159,607,000 |
| 11728266 |
Die stitching and harvesting of arrayed structures |
Jun Zhai, Kunzhong Hu, Raymundo M. Camenforte |
2023-08-15 |
$190,320,000 |
| 11699949 |
Power management system switched capacitor voltage regulator with integrated passive device |
David A. Secker, Jun Zhai, Ralf M. Schmitt, Vidhya Ramachandran, Wenjie Mao |
2023-07-11 |
$274,907,000 |
| 11476203 |
Die-to-die routing through a seal ring |
Jun Zhai |
2022-10-18 |
$195,408,000 |
| 11309895 |
Systems and methods for implementing a scalable system |
Bahattin Kilic, Jie Zhao, Kunzhong Hu, Suk-Kyu Ryu |
2022-04-19 |
$219,368,000 |
| 11309246 |
High density 3D interconnect configuration |
Zhitao Cao, Kunzhong Hu, Jun Zhai |
2022-04-19 |
$219,368,000 |
| 11158607 |
Wafer reconstitution and die-stitching |
Jun Zhai, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran |
2021-10-26 |
$273,635,000 |
