Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermally enhanced chip-on-wafer or wafer-on-wafer bonding

Thermally enhanced chip-on-wafer or wafer-on-wafer bonding

US Patent 12469765 · Granted Nov 11, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wafer level integration of passive devices2025
3D system and wafer reconstitution with mid-layer interposer2025
Microelectronic package RDL patterns to reduce stress in RDLs across components2025
Interconnecting a plurality of dies having spare input/output circuit2025
Interconnecting a plurality of dies having spare input/output circuit2025
Seal ring designs supporting efficient die to die routing2025
High bandwidth die to die interconnect with package area reduction2025
Wafer reconstitution and die-stitching2025
Wafer reconstitution and die-stitching2025
High density interconnection using fanout interposer chiplet2025
Structure and method for sealing a silicon IC2025
Structure and method for sealing a silicon IC2025