Issued Patents All Time
Showing 25 most recent of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322730 | Wafer reconstitution and die-stitching | Sanjay Dabral, Jun Zhai, Kwan-Yu Lai, Kunzhong Hu | 2025-06-03 |
| 12261132 | Structure and method for sealing a silicon IC | Sanjay Dabral, SivaChandra Jangam, Jun Zhai, Kunzhong Hu | 2025-03-25 |
| 11967528 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Jun Zhai, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more | 2024-04-23 |
| 11824015 | Structure and method for sealing a silicon IC | Sanjay Dabral, SivaChandra Jangam, Jun Zhai, Kunzhong Hu | 2023-11-21 |
| 11735567 | Wafer reconstitution and die-stitching | Sanjay Dabral, Jun Zhai, Kwan-Yu Lai, Kunzhong Hu | 2023-08-22 |
| 11699949 | Power management system switched capacitor voltage regulator with integrated passive device | Sanjay Dabral, David A. Secker, Jun Zhai, Ralf M. Schmitt, Wenjie Mao | 2023-07-11 |
| 11670548 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Jun Zhai, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more | 2023-06-06 |
| 11158607 | Wafer reconstitution and die-stitching | Sanjay Dabral, Jun Zhai, Kwan-Yu Lai, Kunzhong Hu | 2021-10-26 |
| 11101732 | Power management system switched capacitor voltage regulator with integrated passive device | Sanjay Dabral, David A. Secker, Jun Zhai, Ralf M. Schmitt, Wenjie Mao | 2021-08-24 |
| 11069665 | Trimmable banked capacitor | Chonghua Zhong, Jun Zhai, Long Huang, Mengzhi Pang, Rohan U. Mandrekar | 2021-07-20 |
| 10818632 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Jun Zhai, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more | 2020-10-27 |
| 10756622 | Power management system switched capacitor voltage regulator with integrated passive device | Sanjay Dabral, David A. Secker, Jun Zhai, Ralf M. Schmitt, Wenjie Mao | 2020-08-25 |
| 10587195 | Integrated passive devices to reduce power supply voltage droop | Shawn Searles | 2020-03-10 |
| 10103138 | Dual-sided silicon integrated passive devices | Jun Zhai, Kunzhong Hu, Mengzhi Pang, Chonghua Zhong | 2018-10-16 |
| 9941156 | Systems and methods to reduce parasitic capacitance | Shiqun Gu, Christine Hau-Riege, John Jianhong Zhu, Jeffrey Junhao Xu, Jihong Choi +2 more | 2018-04-10 |
| 9935076 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Jun Zhai, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more | 2018-04-03 |
| 9922970 | Interposer having stacked devices | Miguel MIRANDA CORBALAN | 2018-03-20 |
| 9748227 | Dual-sided silicon integrated passive devices | Jun Zhai, Kunzhong Hu, Mengzhi Pang, Chonghua Zhong | 2017-08-29 |
| 9548288 | Integrated circuit die decoupling system with reduced inductance | Chonghua Zhong, Shawn Searles, Jun Zhai, Young Doo Jeon, Huabo Chen | 2017-01-17 |
| 9510454 | Integrated interposer with embedded active devices | Urmi Ray, Ravindra V. Shenoy, Kwan-Yu Lai, Jon Bradley Lasiter | 2016-11-29 |
| 9502469 | Electrically reconfigurable interposer with built-in resistive memory | Yu Lu, Seung H. Kang | 2016-11-22 |
| 9401353 | Interposer integrated with 3D passive devices | Shiqun Gu | 2016-07-26 |
| 9379201 | Electrostatic discharge diodes and methods of forming electrostatic discharge diodes | Brian Matthew Henderson, Shiqun Gu, Chiew-Guan Tan, Jung Pill Kim, Taehyun Kim | 2016-06-28 |
| 9355904 | Method for strain-relieved through substrate vias | Shiqun Gu | 2016-05-31 |
| 9276199 | Small form factor magnetic shield for magnetorestrictive random access memory (MRAM) | Shiqun Gu, Rongtian Zhang, Dong Wook Kim | 2016-03-01 |