| 12322730 |
Wafer reconstitution and die-stitching |
Sanjay Dabral, Jun Zhai, Kwan-Yu Lai, Kunzhong Hu |
2025-06-03 |
|
| 12261132 |
Structure and method for sealing a silicon IC |
Sanjay Dabral, SivaChandra Jangam, Jun Zhai, Kunzhong Hu |
2025-03-25 |
|
| 11967528 |
Structure and method for fabricating a computing system with an integrated voltage regulator module |
Jun Zhai, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more |
2024-04-23 |
$223,464,000 |
| 11824015 |
Structure and method for sealing a silicon IC |
Sanjay Dabral, SivaChandra Jangam, Jun Zhai, Kunzhong Hu |
2023-11-21 |
$128,924,000 |
| 11735567 |
Wafer reconstitution and die-stitching |
Sanjay Dabral, Jun Zhai, Kwan-Yu Lai, Kunzhong Hu |
2023-08-22 |
$159,607,000 |
| 11699949 |
Power management system switched capacitor voltage regulator with integrated passive device |
Sanjay Dabral, David A. Secker, Jun Zhai, Ralf M. Schmitt, Wenjie Mao |
2023-07-11 |
$274,907,000 |
| 11670548 |
Structure and method for fabricating a computing system with an integrated voltage regulator module |
Jun Zhai, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more |
2023-06-06 |
$190,322,000 |
| 11158607 |
Wafer reconstitution and die-stitching |
Sanjay Dabral, Jun Zhai, Kwan-Yu Lai, Kunzhong Hu |
2021-10-26 |
$273,635,000 |
| 11101732 |
Power management system switched capacitor voltage regulator with integrated passive device |
Sanjay Dabral, David A. Secker, Jun Zhai, Ralf M. Schmitt, Wenjie Mao |
2021-08-24 |
$193,607,000 |
| 11069665 |
Trimmable banked capacitor |
Chonghua Zhong, Jun Zhai, Long Huang, Mengzhi Pang, Rohan U. Mandrekar |
2021-07-20 |
$287,877,000 |
| 10818632 |
Structure and method for fabricating a computing system with an integrated voltage regulator module |
Jun Zhai, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more |
2020-10-27 |
$347,521,000 |
| 10756622 |
Power management system switched capacitor voltage regulator with integrated passive device |
Sanjay Dabral, David A. Secker, Jun Zhai, Ralf M. Schmitt, Wenjie Mao |
2020-08-25 |
$205,423,000 |
| 10587195 |
Integrated passive devices to reduce power supply voltage droop |
Shawn Searles |
2020-03-10 |
$142,673,000 |
| 10103138 |
Dual-sided silicon integrated passive devices |
Jun Zhai, Kunzhong Hu, Mengzhi Pang, Chonghua Zhong |
2018-10-16 |
$96,757,000 |
| 9941156 |
Systems and methods to reduce parasitic capacitance |
Shiqun Gu, Christine Hau-Riege, John Jianhong Zhu, Jeffrey Junhao Xu, Jihong Choi +2 more |
2018-04-10 |
$10,306,000 |
| 9935076 |
Structure and method for fabricating a computing system with an integrated voltage regulator module |
Jun Zhai, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more |
2018-04-03 |
$86,753,000 |
| 9922970 |
Interposer having stacked devices |
Miguel MIRANDA CORBALAN |
2018-03-20 |
$11,176,000 |
| 9748227 |
Dual-sided silicon integrated passive devices |
Jun Zhai, Kunzhong Hu, Mengzhi Pang, Chonghua Zhong |
2017-08-29 |
$75,964,000 |
| 9548288 |
Integrated circuit die decoupling system with reduced inductance |
Chonghua Zhong, Shawn Searles, Jun Zhai, Young Doo Jeon, Huabo Chen |
2017-01-17 |
$90,030,000 |
| 9510454 |
Integrated interposer with embedded active devices |
Urmi Ray, Ravindra V. Shenoy, Kwan-Yu Lai, Jon Bradley Lasiter |
2016-11-29 |
$8,708,000 |
| 9502469 |
Electrically reconfigurable interposer with built-in resistive memory |
Yu Lu, Seung H. Kang |
2016-11-22 |
$8,308,000 |
| 9401353 |
Interposer integrated with 3D passive devices |
Shiqun Gu |
2016-07-26 |
$14,537,000 |
| 9379201 |
Electrostatic discharge diodes and methods of forming electrostatic discharge diodes |
Brian Matthew Henderson, Shiqun Gu, Chiew-Guan Tan, Jung Pill Kim, Taehyun Kim |
2016-06-28 |
$6,586,000 |
| 9355904 |
Method for strain-relieved through substrate vias |
Shiqun Gu |
2016-05-31 |
$7,978,000 |
| 9276199 |
Small form factor magnetic shield for magnetorestrictive random access memory (MRAM) |
Shiqun Gu, Rongtian Zhang, Dong Wook Kim |
2016-03-01 |
$6,835,000 |
