Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9219032 | Integrating through substrate vias from wafer backside layers of integrated circuits | Shiqun Gu | 2015-12-22 |
| 9093462 | Electrostatic discharge diode | Brian Matthew Henderson, Shiqun Gu, Chiew-Guan Tan, Jung Pill Kim, Taehyun Kim | 2015-07-28 |
| 9059263 | Low-K dielectric protection spacer for patterning through substrate vias through a low-K wiring layer | Shiqun Gu | 2015-06-16 |
| 8975729 | Integrating through substrate vias into middle-of-line layers of integrated circuits | Shiqun Gu | 2015-03-10 |
| 8952504 | Small form factor magnetic shield for magnetorestrictive random access memory (MRAM) | Shiqun Gu, Rongtian Zhang, Dong Wook Kim | 2015-02-10 |
| 8779559 | Structure and method for strain-relieved TSV | Shiqun Gu | 2014-07-15 |
| 7888252 | Self-aligned contact | Johnathan E. Faltermeier, Stephan Grunow, Kangguo Cheng, Kevin S. Petrarca, Kaushik A. Kumar +2 more | 2011-02-15 |
| 7851321 | Semiconductor integrated circuit devices having high-Q wafer back-side capacitors | Lawrence A. Clevenger, Timothy J. Dalton, Louis L. Hsu, Carl Radens, Keith Kwong Hon Wong +1 more | 2010-12-14 |
| 7825019 | Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuits | Lawrence A. Clevenger, Stephan Grunow, Kaushik A. Kumar, Kevin S. Petrarca | 2010-11-02 |
| 7750388 | Trench metal-insulator metal (MIM) capacitors | Herbert L. Ho, Subramanian S. Iyer | 2010-07-06 |
| 7701015 | Bipolar and CMOS integration with reduced contact height | Zhong-Xiang He, Bradley A. Orner, Alvin J. Joseph, Stephen A. St. Onge, Ping-Chuan Wang | 2010-04-20 |
| 7687867 | Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme | Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, William J. Murphy | 2010-03-30 |
| 7682896 | Trench metal-insulator-metal (MIM) capacitors integrated with middle-of-line metal contacts, and method of fabricating same | Herbert L. Ho, Subramanian S. Iyer | 2010-03-23 |
| 7531407 | Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same | Lawrence A. Clevenger, Timothy J. Dalton, Louis L. Hsu, Carl Radens, Keith Kwong Hon Wong +1 more | 2009-05-12 |
| 7511940 | Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask | Douglas D. Coolbaugh, Ebenezer E. Eshun, Natalie B. Feilchenfeld, Michael L. Gautsch, Zhong-Xiang He +2 more | 2009-03-31 |
| 7473979 | Semiconductor integrated circuit devices having high-Q wafer back-side capacitors | Lawrence A. Clevenger, Timothy J. Dalton, Louis L. Hsu, Carl Radens, Keith Kwong Hon Wong +1 more | 2009-01-06 |
| 7456099 | Method of forming a structure for reducing lateral fringe capacitance in semiconductor devices | Lawrence A. Clevenger, Stephan Grunow, Kaushik A. Kumar, Kevin S. Petrarca, Theodorus E. Standaert | 2008-11-25 |
| 7397087 | FEOL/MEOL metal resistor for high end CMOS | Anil K. Chinthakindi, Douglas D. Coolbaugh, Robert M. Rassel | 2008-07-08 |
| 7388244 | Trench metal-insulator-metal (MIM) capacitors and method of fabricating same | Herbert L. Ho, Subramanian S. Iyer | 2008-06-17 |
| 7326987 | Non-continuous encapsulation layer for MIM capacitor | Wagdi W. Abadeer, Eric Adler, Zhong-Xiang He, Bradley A. Orner, Barbara Waterhouse +1 more | 2008-02-05 |
| 7301752 | Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask | Douglas D. Coolbaugh, Ebenezer E. Eshun, Natalie B. Feilchenfeld, Michael L. Gautsch, Zhong-Xiang He +2 more | 2007-11-27 |
| 7282404 | Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme | Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, William J. Murphy | 2007-10-16 |
| 7276751 | Trench metal-insulator-metal (MIM) capacitors integrated with middle-of-line metal contacts, and method of fabricating same | Herbert L. Ho, Subramanian S. Iyer | 2007-10-02 |
| 7160772 | Structure and method for integrating MIM capacitor in BEOL wiring levels | Douglas D. Coolbaugh | 2007-01-09 |
| 6913965 | Non-Continuous encapsulation layer for MIM capacitor | Wagdi W. Abadeer, Eric Adler, Zhong-Xiang He, Bradley A. Orner, Barbara Waterhouse +1 more | 2005-07-05 |