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Optimum padset for wire bonding RF technologies with high-Q inductors |
Douglas D. Coolbaugh, Zhong-Xiang He, Wolfgang Sauter |
2010-07-13 |
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Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask |
Douglas D. Coolbaugh, Ebenezer E. Eshun, Natalie B. Feilchenfeld, Michael L. Gautsch, Zhong-Xiang He +2 more |
2009-03-31 |
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Non-continuous encapsulation layer for MIM capacitor |
Wagdi W. Abadeer, Eric Adler, Zhong-Xiang He, Bradley A. Orner, Vidhya Ramachandran +1 more |
2008-02-05 |
| 7301752 |
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask |
Douglas D. Coolbaugh, Ebenezer E. Eshun, Natalie B. Feilchenfeld, Michael L. Gautsch, Zhong-Xiang He +2 more |
2007-11-27 |
| 7245025 |
Low cost bonding pad and method of fabricating same |
Jeffrey A. Brigante, Zhong-Xiang He, Eric J. White |
2007-07-17 |
| 7170181 |
Optimum padset for wire bonding RF technologies with high-Q inductors |
Douglas D. Coolbaugh, Zhong-Xiang He, Wolfgang Sauter |
2007-01-30 |
| 7056820 |
Bond pad |
Stephen Cole, William J. Murphy |
2006-06-06 |
| 6913965 |
Non-Continuous encapsulation layer for MIM capacitor |
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2005-07-05 |
