Issued Patents All Time
Showing 25 most recent of 144 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12366705 | Photonics optoelectrical system | William Charles, Douglas C. La Tulipe, Jr., Gerald L. Leake | 2025-07-22 |
| 11841531 | Wafer scale bonded active photonics interposer | Douglas C. La Tulipe, Jr., Gerald L. Leake | 2023-12-12 |
| 11703643 | Integrated photonics including waveguiding material | Thomas N. Adam, Gerald L. Leake | 2023-07-18 |
| 11635568 | Photonics light signal transmission | Gerald L. Leake | 2023-04-25 |
| 11550099 | Photonics optoelectrical system | William Charles, Douglas C. La Tulipe, Jr., Gerald L. Leake | 2023-01-10 |
| 11550173 | Heterogeneous structure on an integrated photonics platform | Douglas C. La Tulipe, Jr., Paul A. Morton, Nicholas G. Usechak | 2023-01-10 |
| 11435523 | Wafer scale bonded active photonics interposer | Douglas C. La Tulipe, Jr., Gerald L. Leake | 2022-09-06 |
| 11378739 | Fabricating photonics structure light signal transmission regions | Gerald L. Leake | 2022-07-05 |
| 11029466 | Photonics structure with integrated laser | William Charles, John E. Bowers, Daehwan Jung, Jonathan Klamkin, Douglas C. La Tulipe, Jr. +3 more | 2021-06-08 |
| 10976491 | Photonics interposer optoelectronics | Michael Robert Watts, Michal Lipson, Keren Bergman, Thomas L. Koch, Jeremiah Hebding +2 more | 2021-04-13 |
| 10877300 | Heterogeneous structure on an integrated photonics platform | Douglas C. La Tulipe, Jr., Paul A. Morton, Nicholas G. Usechak | 2020-12-29 |
| 10830952 | Integrated photonics including germanium | Thomas N. Adam, Gerald L. Leake | 2020-11-10 |
| 10816724 | Fabricating photonics structure light signal transmission regions | Gerald L. Leake | 2020-10-27 |
| 10698156 | Wafer scale bonded active photonics interposer | Douglas C. La Tulipe, Jr., Gerald L. Leake | 2020-06-30 |
| 10571631 | Integrated photonics including waveguiding material | Thomas N. Adam, Gerald L. Leake | 2020-02-25 |
| 10295745 | Integrated photonics including germanium | Thomas N. Adam, Gerald L. Leake | 2019-05-21 |
| 9874693 | Method and structure for integrating photonics with CMOs | Christopher V. Baiocco, Gerald L. Leake | 2018-01-23 |
| 9864138 | Integrated photonics including germanium | Thomas N. Adam, Gerald L. Leake | 2018-01-09 |
| 9171778 | Dual-damascene process to fabricate thick wire structure | Keith E. Downes, Peter J. Lindgren, Anthony K. Stamper | 2015-10-27 |
| 8969200 | Apparatus and method for integration of through substrate vias | Jeremiah Hebding, Megha Rao, Colin Albright McDonough, Matthew David Smalley, Joseph Piccirillo, Jr. +3 more | 2015-03-03 |
| 8881379 | Method of making heat sink for integrated circuit devices | Ebenezer E. Eshun, Terence B. Hook, Robert M. Rassel, Edmund J. Sprogis, Anthony K. Stamper +1 more | 2014-11-11 |
| 8872281 | Silicided trench contact to buried conductive layer | Jeffrey B. Johnson, Peter J. Lindgren, Xuefeng Lie, James S. Nakos, Bradley A. Omer +2 more | 2014-10-28 |
| 8753950 | Dual-damascene process to fabricate thick wire structure | Keith E. Downes, Peter J. Lindgren, Anthony K. Stamper | 2014-06-17 |
| 8749293 | Stackable programmable passive device and a testing method | Fen Chen, Baozhen Li | 2014-06-10 |
| 8697542 | Method for thin die-to-wafer bonding | Daniel Pascual, Jeremiah Hebding, Megha Rao, Colin Albright McDonough, Joseph Piccirillo, Jr. +1 more | 2014-04-15 |