Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9171778 | Dual-damascene process to fabricate thick wire structure | Douglas D. Coolbaugh, Keith E. Downes, Anthony K. Stamper | 2015-10-27 |
| 8872281 | Silicided trench contact to buried conductive layer | Douglas D. Coolbaugh, Jeffrey B. Johnson, Xuefeng Lie, James S. Nakos, Bradley A. Omer +2 more | 2014-10-28 |
| 8753950 | Dual-damascene process to fabricate thick wire structure | Douglas D. Coolbaugh, Keith E. Downes, Anthony K. Stamper | 2014-06-17 |
| 8748207 | Hybrid MEMS RF switch and method of fabricating same | Anthony K. Stamper | 2014-06-10 |
| 8722508 | Low harmonic RF switch in SOI | Alan B. Botula, Dinh Dang, James S. Dunn, Alvin J. Joseph | 2014-05-13 |
| 8674423 | Semiconductor structure having vias and high density capacitors | David S. Collins, Kai D. Feng, Zhong-Xiang He, Robert M. Rassel | 2014-03-18 |
| 8674472 | Low harmonic RF switch in SOI | Alan B. Botula, Dinh Dang, James S. Dunn, Alvin J. Joseph | 2014-03-18 |
| 8645898 | Structure and design structure for high-Q value inductor and method of manufacturing the same | Hanyi Ding, Mete Erturk, Robert A. Groves, Zhong-Xiang He, Anthony K. Stamper | 2014-02-04 |
| 8643190 | Through substrate via including variable sidewall profile | Edward C. Cooney, III, Doreen Jane Ossenkop, Anthony K. Stamper | 2014-02-04 |
| 8631570 | Through wafer vias with dishing correction methods | Edmund J. Sprogis, Anthony K. Stamper | 2014-01-21 |
| 8510329 | Distributed and interactive database architecture for parallel and asynchronous data processing of complex data and for real-time query processing | Nevzat Hurkan Balkir, Marc Louis Gutchell, Eric Michael Tagliere | 2013-08-13 |
| 8445306 | Hybrid MEMS RF switch and method of fabricating same | Anthony K. Stamper | 2013-05-21 |
| 8338265 | Silicided trench contact to buried conductive layer | Douglas D. Coolbaugh, Jeffrey B. Johnson, Xuefeng Liu, James S. Nakos, Bradley A. Orner +2 more | 2012-12-25 |
| 8293638 | Method of fabricating damascene structures | Jeffrey P. Gambino, Anthony K. Stamper | 2012-10-23 |
| 8236663 | Dual-damascene process to fabricate thick wire structure | Douglas D. Coolbaugh, Keith E. Downes, Anthony K. Stamper | 2012-08-07 |
| 8234606 | Metal wiring structure for integration with through substrate vias | David S. Collins, Alvin J. Joseph, Anthony K. Stamper, Kimball M. Watson | 2012-07-31 |
| 8232173 | Structure and design structure for high-Q value inductor and method of manufacturing the same | Hanyi Ding, Mete Erturk, Robert A. Groves, Zhong-Xiang He, Anthony K. Stamper | 2012-07-31 |
| 8166651 | Through wafer vias with dishing correction methods | Edmund J. Sprogis, Anthony K. Stamper | 2012-05-01 |
| 8136084 | Arranging through silicon vias in IC layout | Donald R. Dean, Jr., Glen L. Miles, Edmund J. Sprogis, Anthony K. Stamper | 2012-03-13 |
| 8125013 | Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors | David S. Collins, Kai D. Feng, Zhong-Xiang Ile, Robert M. Rassel | 2012-02-28 |
| 8119522 | Method of fabricating damascene structures | Jeffrey P. Gambino, Anthony K. Stamper | 2012-02-21 |
| 8101494 | Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors | David S. Collins, Kai D. Feng, Zhong-Xiang He, Robert M. Rassel | 2012-01-24 |
| 8089135 | Back-end-of-line wiring structures with integrated passive elements and design structures for a radiofrequency integrated circuit | Anthony K. Stamper | 2012-01-03 |
| 8039314 | Metal adhesion by induced surface roughness | Danielle DeGraw, Da-Yuan Shih, Ping-Chuan Wang | 2011-10-18 |
| 8039356 | Through silicon via lithographic alignment and registration | Russell T. Herrin, Edmund J. Sprogis, Anthony K. Stamper | 2011-10-18 |