| 9171778 |
Dual-damascene process to fabricate thick wire structure |
Douglas D. Coolbaugh, Keith E. Downes, Anthony K. Stamper |
2015-10-27 |
|
| 8872281 |
Silicided trench contact to buried conductive layer |
Douglas D. Coolbaugh, Jeffrey B. Johnson, Xuefeng Lie, James S. Nakos, Bradley A. Omer +2 more |
2014-10-28 |
$3,762,000 |
| 8753950 |
Dual-damascene process to fabricate thick wire structure |
Douglas D. Coolbaugh, Keith E. Downes, Anthony K. Stamper |
2014-06-17 |
$4,121,000 |
| 8748207 |
Hybrid MEMS RF switch and method of fabricating same |
Anthony K. Stamper |
2014-06-10 |
$4,765,000 |
| 8722508 |
Low harmonic RF switch in SOI |
Alan B. Botula, Dinh Dang, James S. Dunn, Alvin J. Joseph |
2014-05-13 |
$6,724,000 |
| 8674423 |
Semiconductor structure having vias and high density capacitors |
David S. Collins, Kai D. Feng, Zhong-Xiang He, Robert M. Rassel |
2014-03-18 |
$3,993,000 |
| 8674472 |
Low harmonic RF switch in SOI |
Alan B. Botula, Dinh Dang, James S. Dunn, Alvin J. Joseph |
2014-03-18 |
$3,993,000 |
| 8645898 |
Structure and design structure for high-Q value inductor and method of manufacturing the same |
Hanyi Ding, Mete Erturk, Robert A. Groves, Zhong-Xiang He, Anthony K. Stamper |
2014-02-04 |
$4,435,000 |
| 8643190 |
Through substrate via including variable sidewall profile |
Edward C. Cooney, III, Doreen Jane Ossenkop, Anthony K. Stamper |
2014-02-04 |
$5,863,000 |
| 8631570 |
Through wafer vias with dishing correction methods |
Edmund J. Sprogis, Anthony K. Stamper |
2014-01-21 |
$5,923,000 |
| 8510329 |
Distributed and interactive database architecture for parallel and asynchronous data processing of complex data and for real-time query processing |
Nevzat Hurkan Balkir, Marc Louis Gutchell, Eric Michael Tagliere |
2013-08-13 |
|
| 8445306 |
Hybrid MEMS RF switch and method of fabricating same |
Anthony K. Stamper |
2013-05-21 |
$6,083,000 |
| 8338265 |
Silicided trench contact to buried conductive layer |
Douglas D. Coolbaugh, Jeffrey B. Johnson, Xuefeng Liu, James S. Nakos, Bradley A. Orner +2 more |
2012-12-25 |
|
| 8293638 |
Method of fabricating damascene structures |
Jeffrey P. Gambino, Anthony K. Stamper |
2012-10-23 |
$6,526,000 |
| 8236663 |
Dual-damascene process to fabricate thick wire structure |
Douglas D. Coolbaugh, Keith E. Downes, Anthony K. Stamper |
2012-08-07 |
$7,112,000 |
| 8234606 |
Metal wiring structure for integration with through substrate vias |
David S. Collins, Alvin J. Joseph, Anthony K. Stamper, Kimball M. Watson |
2012-07-31 |
$5,473,000 |
| 8232173 |
Structure and design structure for high-Q value inductor and method of manufacturing the same |
Hanyi Ding, Mete Erturk, Robert A. Groves, Zhong-Xiang He, Anthony K. Stamper |
2012-07-31 |
$5,473,000 |
| 8166651 |
Through wafer vias with dishing correction methods |
Edmund J. Sprogis, Anthony K. Stamper |
2012-05-01 |
$7,417,000 |
| 8136084 |
Arranging through silicon vias in IC layout |
Donald R. Dean, Jr., Glen L. Miles, Edmund J. Sprogis, Anthony K. Stamper |
2012-03-13 |
$7,610,000 |
| 8125013 |
Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors |
David S. Collins, Kai D. Feng, Zhong-Xiang Ile, Robert M. Rassel |
2012-02-28 |
$6,579,000 |
| 8119522 |
Method of fabricating damascene structures |
Jeffrey P. Gambino, Anthony K. Stamper |
2012-02-21 |
$5,017,000 |
| 8101494 |
Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors |
David S. Collins, Kai D. Feng, Zhong-Xiang He, Robert M. Rassel |
2012-01-24 |
$7,514,000 |
| 8089135 |
Back-end-of-line wiring structures with integrated passive elements and design structures for a radiofrequency integrated circuit |
Anthony K. Stamper |
2012-01-03 |
$8,800,000 |
| 8039314 |
Metal adhesion by induced surface roughness |
Danielle DeGraw, Da-Yuan Shih, Ping-Chuan Wang |
2011-10-18 |
$4,054,000 |
| 8039356 |
Through silicon via lithographic alignment and registration |
Russell T. Herrin, Edmund J. Sprogis, Anthony K. Stamper |
2011-10-18 |
$4,054,000 |
