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Inline measurement of through-silicon via depth |
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Matching of bipolar transistor pair through electrical stress |
Ephrem G. Gebreselasie, Alain Loiseau, Joseph M. Lukaitis, Richard A. Poro, III, Andreas D. Stricker |
2017-02-14 |
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Micro-electro-mechanical system (MEMS) structure and design structures |
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2016-11-15 |
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Inline measurement of through-silicon via depth |
Hanyi Ding, J. Edwin Hostetter, Ping-Chuan Wang |
2015-06-16 |
| 8765568 |
Method of fabricating thermally controlled refractory metal resistor |
Joseph M. Lukaitis, Deborah M. Massey, Timothy D. Sullivan, Ping-Chuan Wang |
2014-07-01 |
| 8686478 |
Methods of forming and programming an electronically programmable resistor |
Benjamin T. Voegeli |
2014-04-01 |
| 8592947 |
Thermally controlled refractory metal resistor |
Joseph M. Lukaitis, Deborah M. Massey, Timothy D. Sullivan, Ping-Chuan Wang |
2013-11-26 |
| 8486796 |
Thin film resistors and methods of manufacture |
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2013-07-16 |
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Metal wiring structure for integration with through substrate vias |
David S. Collins, Alvin J. Joseph, Peter J. Lindgren, Anthony K. Stamper |
2012-07-31 |
| 8207609 |
Optically transparent wires for secure circuits and methods of making same |
Stephen P. Ayotte, Jeffrey P. Gambino, Timothy D. Sullivan |
2012-06-26 |
| 8125019 |
Electrically programmable resistor |
Benjamin T. Voegeli |
2012-02-28 |
| 8089160 |
IC interconnect for high current |
Ping-Chuan Wang, Kai Xiu |
2012-01-03 |
| 8017514 |
Optically transparent wires for secure circuits and methods of making same |
Stephen P. Ayotte, Jeffrey P. Gambino, Timothy D. Sullivan |
2011-09-13 |
| 7981732 |
Programming of laser fuse |
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2011-07-19 |
| 7968975 |
Metal wiring structure for integration with through substrate vias |
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2011-06-28 |
| 7919830 |
Method and structure for ballast resistor |
Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel |
2011-04-05 |
| 7919834 |
Edge seal for thru-silicon-via technology |
Robert Edgar Davis, Robert D. Edwards, J. Edwin Hostetter, Ping-Chuan Wang |
2011-04-05 |
| 7904273 |
In-line depth measurement for thru silicon via |
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2011-03-08 |
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Structures including means for lateral current carrying capability improvement in semiconductor devices |
Natalie B. Feilchenfeld, Zhong-Xiang He, Qizhi Liu, BethAnn Rainey, Ping-Chuan Wang |
2011-03-08 |
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Methods for lateral current carrying capability improvement in semiconductor devices |
Natalie B. Feilchenfeld, Zhong-Xiang He, Qizhi Liu, BethAnn Rainey, Ping-Chuan Wang |
2008-11-18 |
| 7384824 |
Structure and programming of laser fuse |
Dinesh A. Badami, Tom C. Lee, Baozhen Li, Gerald Matusiewicz, William T. Motsiff +2 more |
2008-06-10 |
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Structure and programming of laser fuse |
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2006-06-20 |
| 5634001 |
Method to calculate hot-electron test voltage differential for assessing microprocessor reliability |
Steven W. Mittl, David E. Moran, Timothy J. O'Gorman |
1997-05-27 |
| 5533197 |
Method to assess electromigration and hot electron reliability for microprocessors |
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1996-07-02 |
