Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9865514 | Inline measurement of through-silicon via depth | Hanyi Ding, J. Edwin Hostetter, Ping-Chuan Wang | 2018-01-09 |
| 9568538 | Matching of bipolar transistor pair through electrical stress | Ephrem G. Gebreselasie, Alain Loiseau, Joseph M. Lukaitis, Richard A. Poro, III, Andreas D. Stricker | 2017-02-14 |
| 9496110 | Micro-electro-mechanical system (MEMS) structure and design structures | Ward Johnson, Jenifer E. Lary, Anthony K. Stamper, Pui L. Yee | 2016-11-15 |
| 9059051 | Inline measurement of through-silicon via depth | Hanyi Ding, J. Edwin Hostetter, Ping-Chuan Wang | 2015-06-16 |
| 8765568 | Method of fabricating thermally controlled refractory metal resistor | Joseph M. Lukaitis, Deborah M. Massey, Timothy D. Sullivan, Ping-Chuan Wang | 2014-07-01 |
| 8686478 | Methods of forming and programming an electronically programmable resistor | Benjamin T. Voegeli | 2014-04-01 |
| 8592947 | Thermally controlled refractory metal resistor | Joseph M. Lukaitis, Deborah M. Massey, Timothy D. Sullivan, Ping-Chuan Wang | 2013-11-26 |
| 8486796 | Thin film resistors and methods of manufacture | David L. Harmon, Joseph M. Lukaitis, Stewart E. Rauch, III, Robert R. Robison, Dustin K. Slisher +2 more | 2013-07-16 |
| 8234606 | Metal wiring structure for integration with through substrate vias | David S. Collins, Alvin J. Joseph, Peter J. Lindgren, Anthony K. Stamper | 2012-07-31 |
| 8207609 | Optically transparent wires for secure circuits and methods of making same | Stephen P. Ayotte, Jeffrey P. Gambino, Timothy D. Sullivan | 2012-06-26 |
| 8125019 | Electrically programmable resistor | Benjamin T. Voegeli | 2012-02-28 |
| 8089160 | IC interconnect for high current | Ping-Chuan Wang, Kai Xiu | 2012-01-03 |
| 8017514 | Optically transparent wires for secure circuits and methods of making same | Stephen P. Ayotte, Jeffrey P. Gambino, Timothy D. Sullivan | 2011-09-13 |
| 7981732 | Programming of laser fuse | Dinesh A. Badami, Tom C. Lee, Baozhen Li, Gerald Matusiewicz, William T. Motsiff +2 more | 2011-07-19 |
| 7968975 | Metal wiring structure for integration with through substrate vias | David S. Collins, Alvin J. Joseph, Peter J. Lindgren, Anthony K. Stamper | 2011-06-28 |
| 7919830 | Method and structure for ballast resistor | Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Robert M. Rassel | 2011-04-05 |
| 7919834 | Edge seal for thru-silicon-via technology | Robert Edgar Davis, Robert D. Edwards, J. Edwin Hostetter, Ping-Chuan Wang | 2011-04-05 |
| 7904273 | In-line depth measurement for thru silicon via | Qizhi Liu, Ping-Chuan Wang, Zhijian Yang | 2011-03-08 |
| 7904868 | Structures including means for lateral current carrying capability improvement in semiconductor devices | Natalie B. Feilchenfeld, Zhong-Xiang He, Qizhi Liu, BethAnn Rainey, Ping-Chuan Wang | 2011-03-08 |
| 7453151 | Methods for lateral current carrying capability improvement in semiconductor devices | Natalie B. Feilchenfeld, Zhong-Xiang He, Qizhi Liu, BethAnn Rainey, Ping-Chuan Wang | 2008-11-18 |
| 7384824 | Structure and programming of laser fuse | Dinesh A. Badami, Tom C. Lee, Baozhen Li, Gerald Matusiewicz, William T. Motsiff +2 more | 2008-06-10 |
| 7064409 | Structure and programming of laser fuse | Dinesh A. Badami, Tom C. Lee, Baozhen Li, Gerald Matusiewicz, William T. Motsiff +2 more | 2006-06-20 |
| 5634001 | Method to calculate hot-electron test voltage differential for assessing microprocessor reliability | Steven W. Mittl, David E. Moran, Timothy J. O'Gorman | 1997-05-27 |
| 5533197 | Method to assess electromigration and hot electron reliability for microprocessors | David E. Moran, Timothy J. O'Gorman | 1996-07-02 |