| 10794948 |
Electromigration monitor |
Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran +2 more |
2020-10-06 |
| 10677833 |
Electromigration monitor |
Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran +2 more |
2020-06-09 |
| 10571490 |
Solder bump array probe tip structure for laser cleaning |
David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell +2 more |
2020-02-25 |
| 10245667 |
Chip joining by induction heating |
Stephen P. Ayotte, Glen E. Richard, Timothy M. Sullivan |
2019-04-02 |
| 10224225 |
Centering substrates on a chuck |
Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson +1 more |
2019-03-05 |
| 10049897 |
Extrusion-resistant solder interconnect structures and methods of forming |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2018-08-14 |
| 9997385 |
Centering substrates on a chuck |
Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson +1 more |
2018-06-12 |
| 9891261 |
Electromigration monitor |
Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran +2 more |
2018-02-13 |
| 9835653 |
Solder bump array probe tip structure for laser cleaning |
David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell +2 more |
2017-12-05 |
| 9776270 |
Chip joining by induction heating |
Stephen P. Ayotte, Glen E. Richard, Timothy M. Sullivan |
2017-10-03 |
| 9773726 |
Three-dimensional integrated circuit integration |
Thomas A. Wassick |
2017-09-26 |
| 9716010 |
Handle wafer |
Jeffrey P. Gambino, Kenneth F. McAvey, Jr., Charles F. Musante, Bruce W. Porth, Anthony K. Stamper |
2017-07-25 |
| 9685362 |
Apparatus and method for centering substrates on a chuck |
Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson +1 more |
2017-06-20 |
| 9613921 |
Structure to prevent solder extrusion |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2017-04-04 |
| 9607862 |
Extrusion-resistant solder interconnect structures and methods of forming |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2017-03-28 |
| 9536829 |
Programmable electrical fuse in keep out zone |
Mukta G. Farooq, Ping-Chuan Wang, Lijuan Zhang |
2017-01-03 |
| 9515035 |
Three-dimensional integrated circuit integration |
Thomas A. Wassick |
2016-12-06 |
| 9508578 |
Method and apparatus for detecting foreign material on a chuck |
Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson +1 more |
2016-11-29 |
| 9484301 |
Controlled metal extrusion opening in semiconductor structure and method of forming |
Max G. Levy, Gary L. Milo, Matthew D. Moon, Anthony C. Speranza, David C. Thomas +1 more |
2016-11-01 |
| 9472490 |
IC structure with recessed solder bump area and methods of forming same |
Timothy M. Sullivan, Glen E. Richard, Stephen P. Ayotte |
2016-10-18 |
| 9404953 |
Structures and methods for monitoring dielectric reliability with through-silicon vias |
Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekharan Kothandaraman, John M. Safran |
2016-08-02 |
| 9362229 |
Semiconductor devices with enhanced electromigration performance |
Jeffrey P. Gambino, David L. Harame, Baozhen Li, Bjorn K. A. Zetterlund |
2016-06-07 |
| 9331037 |
Preventing misshaped solder balls |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2016-05-03 |
| 9318414 |
Integrated circuit structure with through-semiconductor via |
Fen Chen, Minhua Lu, Ping-Chuan Wang, Lijuan Zhang |
2016-04-19 |
| 9318413 |
Integrated circuit structure with metal cap and methods of fabrication |
Fen Chen, Andrew Tae Kim, Minhua Lu, Ping-Chuan Wang, Lijuan Zhang |
2016-04-19 |
