Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163673 | Dual adhesive bonding with perforated wafer | Jeffrey P. Gambino, Charles F. Musante, Anthony K. Stamper | 2018-12-25 |
| 9716010 | Handle wafer | Jeffrey P. Gambino, Charles F. Musante, Bruce W. Porth, Anthony K. Stamper, Timothy D. Sullivan | 2017-07-25 |
| 8912091 | Backside metal ground plane with improved metal adhesion and design structures | Jay Burnham, Damyon L. Corbin, George A. Dunbar, III, Jeffrey P. Gambino, John C. Hall +2 more | 2014-12-16 |
| 8536035 | Silicon-on-insulator substrate and method of forming | Alan B. Botula, Mark D. Jaffe, Alvin J. Joseph, Gerd Pfeiffer, Richard A. Phelps | 2013-09-17 |
| 7531059 | Cleaning of semiconductor wafers by contaminate encapsulation | Nicole S. Carpenter, Joseph Drennan, Alison K. Easton, Casey J. Grant, Andrew Hoadley +3 more | 2009-05-12 |
| 7176119 | Method of fabricating copper damascene and dual damascene interconnect wiring | Jeffrey P. Gambino, William R. Hill, Thomas L. McDevitt, Anthony K. Stamper, Arthur C. Winslow +1 more | 2007-02-13 |
| 6939408 | Method for surface preparation of workpieces utilizing fluid separation techniques | Francis A. Abramovich, Nicole S. Carpenter, Joseph Drennan, Rick H. Gaylord, Casey J. Grant +5 more | 2005-09-06 |
| 6776171 | Cleaning of semiconductor wafers by contaminate encapsulation | Nicole S. Carpenter, Joseph Drennan, Alison K. Easton, Casey J. Grant, Andrew Hoadley +3 more | 2004-08-17 |