| 10794948 |
Electromigration monitor |
Fen Chen, Mukta G. Farooq, Chandrasekaran Kothandaraman, John M. Safran, Timothy D. Sullivan +2 more |
2020-10-06 |
| 10677833 |
Electromigration monitor |
Fen Chen, Mukta G. Farooq, Chandrasekaran Kothandaraman, John M. Safran, Timothy D. Sullivan +2 more |
2020-06-09 |
| 9891261 |
Electromigration monitor |
Fen Chen, Mukta G. Farooq, Chandrasekaran Kothandaraman, John M. Safran, Timothy D. Sullivan +2 more |
2018-02-13 |
| 9404953 |
Structures and methods for monitoring dielectric reliability with through-silicon vias |
Fen Chen, Mukta G. Farooq, Chandrasekharan Kothandaraman, John M. Safran, Timothy D. Sullivan |
2016-08-02 |
| 9059167 |
Structure and method for making crack stop for 3D integrated circuits |
Mukta G. Farooq, William Francis Landers, Ian D. Melville, Thomas M. Shaw, Huilong Zhu |
2015-06-16 |
| 9040418 |
Enhanced capture pads for through semiconductor vias |
Mukta G. Farooq, Gary LaFontant, Kevin S. Petrarca, Richard P. Volant |
2015-05-26 |
| 8859390 |
Structure and method for making crack stop for 3D integrated circuits |
Mukta G. Farooq, William Francis Landers, Ian D. Melville, Thomas M. Shaw, Huilong Zhu |
2014-10-14 |
| 8772949 |
Enhanced capture pads for through semiconductor vias |
Mukta G. Farooq, Gary LaFontant, Kevin S. Petrarca, Richard P. Volant |
2014-07-08 |
| 8386977 |
Circuit design checking for three dimensional chip technology |
Mukta G. Farooq, William Francis Landers, Kevin S. Petrarca, Richard P. Volant |
2013-02-26 |
| 8288270 |
Enhanced electromigration resistance in TSV structure and design |
Mukta G. Farooq, Gary LaFontant, William Francis Landers, Timothy D. Sullivan |
2012-10-16 |
| 8237288 |
Enhanced electromigration resistance in TSV structure and design |
Mukta G. Farooq, Gary LaFontant, William Francis Landers, Timothy D. Sullivan |
2012-08-07 |
