Issued Patents All Time
Showing 51–75 of 153 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8766439 | Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2014-07-01 |
| 8765568 | Method of fabricating thermally controlled refractory metal resistor | Joseph M. Lukaitis, Deborah M. Massey, Ping-Chuan Wang, Kimball M. Watson | 2014-07-01 |
| 8680675 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2014-03-25 |
| 8674506 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more | 2014-03-18 |
| 8669660 | Solder interconnect pads with current spreading layers | Timothy H. Daubenspeck | 2014-03-11 |
| 8652922 | Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture | Joseph M. Lukaitis, Jed H. Rankin, Robert R. Robison, Dustin K. Slisher | 2014-02-18 |
| 8647909 | Array of alpha particle sensors | Ethan H. Cannon, Michael J. Hauser | 2014-02-11 |
| 8637392 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy +3 more | 2014-01-28 |
| 8629557 | Structures and methods for detecting solder wetting of pedestal sidewalls | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2014-01-14 |
| 8592947 | Thermally controlled refractory metal resistor | Joseph M. Lukaitis, Deborah M. Massey, Ping-Chuan Wang, Kimball M. Watson | 2013-11-26 |
| 8592976 | Ball-limiting-metallurgy layers in solder ball structures | Charles L. Arvin, Timothy H. Daubenspeck, Wolfgang Sauter | 2013-11-26 |
| 8580673 | Underfill flow guide structures and method of using same | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Marie-Claude Paquet, Wolfgang Sauter | 2013-11-12 |
| 8569888 | Wiring structure and method of forming the structure | Fen Chen, Jeffrey P. Gambino, Anthony K. Stamper | 2013-10-29 |
| 8546253 | Self-aligned polymer passivation/aluminum pad | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2013-10-01 |
| 8541864 | Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture | Joseph M. Lukaitis, Jed H. Rankin, Robert R. Robison, Dustin K. Slisher | 2013-09-24 |
| 8513814 | Buffer pad in solder bump connections and methods of manufacture | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2013-08-20 |
| 8508043 | Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad, Wolfgang Sauter | 2013-08-13 |
| 8486796 | Thin film resistors and methods of manufacture | David L. Harmon, Joseph M. Lukaitis, Stewart E. Rauch, III, Robert R. Robison, Dustin K. Slisher +2 more | 2013-07-16 |
| 8480302 | Micro-electro-mechanical-system temperature sensor | Jason P. Gill, David L. Harmon | 2013-07-09 |
| 8446006 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more | 2013-05-21 |
| 8426247 | Polymer and solder pillars for connecting chip and carrier | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2013-04-23 |
| 8409980 | Underfill flow guide structures and method of using same | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Marie-Claude Paquet, Wolfgang Sauter | 2013-04-02 |
| 8350383 | IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2013-01-08 |
| 8338947 | Solder interconnect pads with current spreading layers | Timothy H. Daubenspeck | 2012-12-25 |
| 8298904 | Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture | Joseph M. Lukaitis, Jed H. Rankin, Robert R. Robison, Dustin K. Slisher | 2012-10-30 |