| 8796108 |
Isolated zener diode, an integrated circuit incorporating multiple instances of the zener diode, a method of forming the zener diode and a design structure for the zener diode |
Frederick G. Anderson, Natalie B. Feilchenfeld, Richard A. Phelps, Yun Shi, Michael J. Zierak |
2014-08-05 |
$3,332,000 |
| 8492866 |
Isolated Zener diode |
Frederick G. Anderson, Natalie B. Feilchenfeld, Richard A. Phelps, Yun Shi, Michael J. Zierak |
2013-07-23 |
$2,085,000 |
| 8486796 |
Thin film resistors and methods of manufacture |
Joseph M. Lukaitis, Stewart E. Rauch, III, Robert R. Robison, Dustin K. Slisher, Jeffrey H. Sloan +2 more |
2013-07-16 |
$5,283,000 |
| 8480302 |
Micro-electro-mechanical-system temperature sensor |
Jason P. Gill, Timothy D. Sullivan |
2013-07-09 |
$6,470,000 |
| 7511378 |
Enhancement of performance of a conductive wire in a multilayered substrate |
Jason P. Gill, Deborah M. Massey, Alvin W. Strong, Timothy D. Sullivan, Junichi Furukawa |
2009-03-31 |
$5,042,000 |
| 7132318 |
Method of assessing potential for charging damage in SOI designs and structures for eliminating potential for damage |
Henry A. Bonges, III, Terence B. Hook, Wing L. Lai |
2006-11-07 |
$5,535,000 |
| 7096450 |
Enhancement of performance of a conductive wire in a multilayered substrate |
Jason P. Gill, Deborah M. Massey, Alvin W. Strong, Timothy D. Sullivan, Junichi Furukawa |
2006-08-22 |
$7,514,000 |
| 7067886 |
Method of assessing potential for charging damage in SOI designs and structures for eliminating potential for damage |
Henry A. Bonges, III, Terence B. Hook, Wing L. Lai |
2006-06-27 |
$5,894,000 |
| 6139647 |
Selective removal of vertical portions of a film |
Michael D. Armacost, Steven A. Grundon, Donald M. Kenney |
2000-10-31 |
$31,312,000 |
| 5767017 |
Selective removal of vertical portions of a film |
Michael D. Armacost, Steven A. Grundon, Donald M. Kenney |
1998-06-16 |
$7,430,000 |
| 5714798 |
Selective deposition process |
Michael D. Armacost, Steven A. Grundon, Son V. Nguyen, John F. Rembetski |
1998-02-03 |
$15,523,000 |
| 5686345 |
Trench mask for forming deep trenches in a semiconductor substrate, and method of using same |
Nancy T. Pascoe, John F. Rembetski, Pai-Hung Pan |
1997-11-11 |
$20,149,000 |
| 5618379 |
Selective deposition process |
Michael D. Armacost, Steven A. Grundon, Son V. Nguyen, John F. Rembetski |
1997-04-08 |
$14,871,000 |
| 5539154 |
Fluorinated silicon nitride films |
Son V. Nguyen, David M. Dobuzinsky, Douglas J. Dopp |
1996-07-23 |
$7,499,000 |
| 5462812 |
Fluorinated silicon nitride films |
Son V. Nguyen, David M. Dobuzinsky, Douglas J. Dopp |
1995-10-31 |
|
| 5412246 |
Low temperature plasma oxidation process |
David M. Dobuzinsky, Srinandan R. Kasi, Donald M. Kenney, Son V. Nguyen, Tue Nguyen +1 more |
1995-05-02 |
$11,222,000 |
| 5330935 |
Low temperature plasma oxidation process |
David M. Dobuzinsky, Srinandan R. Kasi, Donald M. Kenney, Son Van Nguyen, Tue Nguyen +1 more |
1994-07-19 |
$16,965,000 |
| 5298790 |
Reactive ion etching buffer mask |
Michael L. Kerbaugh, Nancy T. Pascoe, John F. Rembetski |
1994-03-29 |
$7,345,000 |
| 5204138 |
Plasma enhanced CVD process for fluorinated silicon nitride films |
Son V. Nguyen, David M. Dobuzinsky, Douglas J. Dopp |
1993-04-20 |
$8,588,000 |
| 5118384 |
Reactive ion etching buffer mask |
Michael L. Kerbaugh, Nancy T. Pascoe, John F. Rembetski |
1992-06-02 |
$7,916,000 |
