| 12432960 |
Wraparound contact with reduced distance to channel |
Ruilong Xie, Reinaldo Vega, Yao Yao, Andrew M. Greene, Veeraraghavan S. Basker +2 more |
2025-09-30 |
| 12402546 |
Composite material phase change memory cell |
Timothy Mathew Philip, Kevin W. Brew, Caitlin Camille Stuckey, Rebecca Martin, Lawrence A. Clevenger |
2025-08-26 |
| 12402391 |
Stressed material within gate cut region |
Huimei Zhou, Andrew M. Greene, Michael P. Belyansky, Oleg Gluschenkov, Juntao Li +2 more |
2025-08-26 |
| 12356685 |
Looped long channel field-effect transistor |
Ruilong Xie, Ardasheir Rahman, Hemanth Jagannathan, Brent A. Anderson, Heng Wu |
2025-07-08 |
| 12268030 |
Self-aligned C-shaped vertical field effect transistor |
Ruilong Xie, Hemanth Jagannathan, Jay William Strane |
2025-04-01 |
| 12243819 |
Single-mask alternating line deposition |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo |
2025-03-04 |
| 12062703 |
Self aligned replacement metal source/drain FINFET |
Emre Alptekin, Reinaldo Vega |
2024-08-13 |
| 12015069 |
Gate-all-around field effect transistor having multiple threshold voltages |
Ruqiang Bao, Michael A. Guillorn, Terence B. Hook, Reinaldo Vega, Tenko Yamashita |
2024-06-18 |
| 11990410 |
Top via interconnect having a line with a reduced bottom dimension |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi |
2024-05-21 |
| 11961759 |
Interconnects having spacers for improved top via critical dimension and overlay tolerance |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi |
2024-04-16 |
| 11894265 |
Top via with damascene line and via |
Lawrence A. Clevenger, Brent A. Anderson, Kisik Choi, Nicholas Anthony Lanzillo, Christopher J. Penny |
2024-02-06 |
| 11869937 |
Semiconductor device and method of forming the semiconductor device |
Marc A. Bergendahl, Gauri Karve, Fee Li Lie, Eric R. Miller, John R. Sporre +1 more |
2024-01-09 |
| 11869936 |
Semiconductor device and method of forming the semiconductor device |
Marc A. Bergendahl, Gauri Karve, Fee Li Lie, Eric R. Miller, John R. Sporre +1 more |
2024-01-09 |
| 11869808 |
Top via process with damascene metal |
Lawrence A. Clevenger, Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi |
2024-01-09 |
| 11854884 |
Fully aligned top vias |
Nicholas Anthony Lanzillo, Koichi Motoyama, Somnath Ghosh, Christopher J. Penny, Lawrence A. Clevenger |
2023-12-26 |
| 11823998 |
Top via with next level line selective growth |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Nicholas Anthony Lanzillo, Kisik Choi |
2023-11-21 |
| 11804406 |
Top via cut fill process for line extension reduction |
Christopher J. Penny, Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo |
2023-10-31 |
| 11791258 |
Conductive lines with subtractive cuts |
Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo, Christopher J. Penny |
2023-10-17 |
| 11757012 |
Source and drain contact cut last process to enable wrap-around-contact |
Andrew M. Greene, Dechao Guo, Tenko Yamashita, Veeraraghavan S. Basker, Ardasheir Rahman |
2023-09-12 |
| 11682617 |
High aspect ratio vias for integrated circuits |
Nicholas Anthony Lanzillo, Somnath Ghosh, Lawrence A. Clevenger |
2023-06-20 |
| 11670542 |
Stepped top via for via resistance reduction |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo |
2023-06-06 |
| 11621189 |
Barrier-less prefilled via formation |
Nicholas Anthony Lanzillo, Hosadurga Shobha, Junli Wang, Lawrence A. Clevenger, Christopher J. Penny +1 more |
2023-04-04 |
| 11600565 |
Top via stack |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo |
2023-03-07 |
| 11527434 |
Line cut patterning using sacrificial material |
Timothy Mathew Philip, Daniel James Dechene, Somnath Ghosh |
2022-12-13 |
| 11437317 |
Single-mask alternating line deposition |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo |
2022-09-06 |
