| 11430735 |
Barrier removal for conductor in top via integration scheme |
Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Lawrence A. Clevenger, Kisik Choi |
2022-08-30 |
| 11380836 |
Topological qubit device |
Steven J. Holmes, Timothy Mathew Philip, Sagarika Mukesh, Youngseok Kim, Devendra K. Sadana |
2022-07-05 |
| 11342446 |
Nanosheet field effect transistors with partial inside spacers |
Michael A. Guillorn, Terence B. Hook, Reinaldo Vega, Rajasekhar Venigalla |
2022-05-24 |
| 11335850 |
Magnetoresistive random-access memory device including magnetic tunnel junctions |
Karthik Yogendra, Eric Raymond Evarts |
2022-05-17 |
| 11302575 |
Subtractive line with damascene second line type |
Brent A. Anderson, Christopher J. Penny, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Kisik Choi |
2022-04-12 |
| 11295978 |
Interconnects having spacers for improved top via critical dimension and overlay tolerance |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi |
2022-04-05 |
| 11289371 |
Top vias with selectively retained etch stops |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Nicholas Anthony Lanzillo, Kisik Choi |
2022-03-29 |
| 11276639 |
Conductive lines with subtractive cuts |
Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo, Christopher J. Penny |
2022-03-15 |
| 11276611 |
Top via on subtractively etched conductive line |
Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo, Christopher J. Penny |
2022-03-15 |
| 11245020 |
Gate-all-around field effect transistor having multiple threshold voltages |
Ruqiang Bao, Michael A. Guillorn, Terence B. Hook, Reinaldo Vega, Tenko Yamashita |
2022-02-08 |
| 11239316 |
Semiconductor device and method of forming the semiconductor device |
Marc A. Bergendahl, Gauri Karve, Fee Li Lie, Eric R. Miller, John R. Sporre +1 more |
2022-02-01 |
| 11232977 |
Stepped top via for via resistance reduction |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo |
2022-01-25 |
| 11217481 |
Fully aligned top vias |
Nicholas Anthony Lanzillo, Koichi Motoyama, Somnath Ghosh, Christopher J. Penny, Lawrence A. Clevenger |
2022-01-04 |
| 11195795 |
Well-controlled edge-to-edge spacing between adjacent interconnects |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi |
2021-12-07 |
| 11195792 |
Top via stack |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo |
2021-12-07 |
| 11189568 |
Top via interconnect having a line with a reduced bottom dimension |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi |
2021-11-30 |
| 11177166 |
Etch stop layer removal for capacitance reduction in damascene top via integration |
Christopher J. Penny, Brent A. Anderson, Lawrence A. Clevenger, Kisik Choi, Nicholas Anthony Lanzillo |
2021-11-16 |
| 11177160 |
Double patterned lithography using spacer assisted cuts for patterning steps |
Timothy Mathew Philip, Somnath Ghosh |
2021-11-16 |
| 11171084 |
Top via with next level line selective growth |
Brent A. Anderson, Lawrence A. Clevenger, Christopher J. Penny, Nicholas Anthony Lanzillo, Kisik Choi |
2021-11-09 |
| 11164777 |
Top via with damascene line and via |
Lawrence A. Clevenger, Brent A. Anderson, Kisik Choi, Nicholas Anthony Lanzillo, Christopher J. Penny |
2021-11-02 |
| 11158537 |
Top vias with subtractive line formation |
Brent A. Anderson, Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi |
2021-10-26 |
| 11158536 |
Patterning line cuts before line patterning using sacrificial fill material |
Daniel James Dechene, Timothy Mathew Philip, Somnath Ghosh |
2021-10-26 |
| 11152464 |
Self-aligned isolation for nanosheet transistor |
Balasubramanian S. Pranatharthi Haran, Ruilong Xie, Veeraraghavan S. Basker |
2021-10-19 |
| 11152299 |
Hybrid selective dielectric deposition for aligned via integration |
Nicholas Anthony Lanzillo, Christopher J. Penny, Hosadurga Shobha, Lawrence A. Clevenger |
2021-10-19 |
| 11152257 |
Barrier-less prefilled via formation |
Nicholas Anthony Lanzillo, Hosadurga Shobha, Junli Wang, Lawrence A. Clevenger, Christopher J. Penny +1 more |
2021-10-19 |
