HI

Henry A. Bonges, III

IBM: 11 patents #9,995 of 70,183Top 15%
📍 Colchester, VT: #63 of 432 inventorsTop 15%
🗺 Vermont: #658 of 4,968 inventorsTop 15%
Overall (All Time): #464,176 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
8635575 System and method to improve chip yield, reliability and performance 2014-01-21
8185859 System and method to improve chip yield, reliability and performance 2012-05-22
7941780 Intersect area based ground rule for semiconductor design Albrik Avanessian, Dureseti Chidambarrao, Stephen E. Greco, Douglas W. Kemerer, Tina Wagner 2011-05-10
7712057 Determining allowance antenna area as function of total gate insulator area for SOI technology Terence B. Hook, William F. Pokorny, Jeffrey S. Zimmerman 2010-05-04
7299426 System and method to improve chip yield, reliability and performance 2007-11-20
7275226 Method of performing latch up check on an integrated circuit design David C. Reynolds, James E. Sundquist 2007-09-25
7132318 Method of assessing potential for charging damage in SOI designs and structures for eliminating potential for damage David L. Harmon, Terence B. Hook, Wing L. Lai 2006-11-07
7120887 Cloned and original circuit shape merging Michael S. Gray, Jason D. Hibbeler, Kevin W. McCullen, Robert F. Walker 2006-10-10
7067886 Method of assessing potential for charging damage in SOI designs and structures for eliminating potential for damage David L. Harmon, Terence B. Hook, Wing L. Lai 2006-06-27
5313424 Module level electronic redundancy Robert Dean Adams, James Dawson, Erik L. Hedberg 1994-05-17
5101120 BiCMOS output driver Roy C. Flaker 1992-03-31