Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756911 | Metal pad modification | Krishna R. Tunga | 2023-09-12 |
| 10622319 | Final passivation for wafer level warpage and ULK stress reduction | Krishna R. Tunga | 2020-04-14 |
| 10593639 | Metal pad modification | Krishna R. Tunga | 2020-03-17 |
| 10373925 | Metal pad modification | Krishna R. Tunga | 2019-08-06 |
| 10096557 | Tiled-stress-alleviating pad structure | Mukta G. Farooq, Krishna R. Tunga | 2018-10-09 |
| 10090271 | Metal pad modification | Krishna R. Tunga | 2018-10-02 |
| 9842810 | Tiled-stress-alleviating pad structure | Mukta G. Farooq, Krishna R. Tunga | 2017-12-12 |
| 9754905 | Final passivation for wafer level warpage and ULK stress reduction | Krishna R. Tunga | 2017-09-05 |
| 9633962 | Plug via formation with grid features in the passivation layer | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2017-04-25 |
| 9431359 | Coaxial solder bump support structure | Brian M. Erwin, Ian D. Melville, George J. Scott | 2016-08-30 |
| 9214385 | Semiconductor device including passivation layer encapsulant | Brian M. Erwin, Karen P. McLaughlin | 2015-12-15 |
| 9159696 | Plug via formation by patterned plating and polishing | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2015-10-13 |
| 8937009 | Far back end of the line metallization method and structures | Timothy H. Daubenspeck, Jeffrey P. Gambino, Karen P. McLaughlin, Christopher D. Muzzy, Eric D. Perfecto +1 more | 2015-01-20 |
| 8778792 | Solder bump connections | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, George J. Scott | 2014-07-15 |
| 8674506 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, George J. Scott +6 more | 2014-03-18 |
| 8563416 | Coaxial solder bump support structure | Brian M. Erwin, Ian D. Melville, George J. Scott | 2013-10-22 |
| 8492892 | Solder bump connections | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, George J. Scott | 2013-07-23 |
| 8446006 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, George J. Scott +6 more | 2013-05-21 |
| 8299581 | Passivation layer extension to chip edge | Timothy H. Daubenspeck, Marie-Claude Paquet, Francis Santerre, Wolfgang Sauter | 2012-10-30 |
| 8298929 | Offset solder vias, methods of manufacturing and design structures | Timothy H. Daubenspeck, Gary LaFontant, David L. Questad, George J. Scott, Krystyna W. Semkow +3 more | 2012-10-30 |
| 7888263 | Cladded silver and silver alloy metallization for improved adhesion electromigration resistance | Terry L. Alford | 2011-02-15 |
| 7446037 | Cladded silver and silver alloy metallization for improved adhesion and electromigration resistance | Terry L. Alford | 2008-11-04 |