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Metal pad modification |
Krishna R. Tunga |
2023-09-12 |
| 10622319 |
Final passivation for wafer level warpage and ULK stress reduction |
Krishna R. Tunga |
2020-04-14 |
| 10593639 |
Metal pad modification |
Krishna R. Tunga |
2020-03-17 |
| 10373925 |
Metal pad modification |
Krishna R. Tunga |
2019-08-06 |
| 10096557 |
Tiled-stress-alleviating pad structure |
Mukta G. Farooq, Krishna R. Tunga |
2018-10-09 |
| 10090271 |
Metal pad modification |
Krishna R. Tunga |
2018-10-02 |
| 9842810 |
Tiled-stress-alleviating pad structure |
Mukta G. Farooq, Krishna R. Tunga |
2017-12-12 |
| 9754905 |
Final passivation for wafer level warpage and ULK stress reduction |
Krishna R. Tunga |
2017-09-05 |
| 9633962 |
Plug via formation with grid features in the passivation layer |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2017-04-25 |
| 9431359 |
Coaxial solder bump support structure |
Brian M. Erwin, Ian D. Melville, George J. Scott |
2016-08-30 |
| 9214385 |
Semiconductor device including passivation layer encapsulant |
Brian M. Erwin, Karen P. McLaughlin |
2015-12-15 |
| 9159696 |
Plug via formation by patterned plating and polishing |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2015-10-13 |
| 8937009 |
Far back end of the line metallization method and structures |
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2015-01-20 |
| 8778792 |
Solder bump connections |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, George J. Scott |
2014-07-15 |
| 8674506 |
Structures and methods to reduce maximum current density in a solder ball |
Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, George J. Scott +6 more |
2014-03-18 |
| 8563416 |
Coaxial solder bump support structure |
Brian M. Erwin, Ian D. Melville, George J. Scott |
2013-10-22 |
| 8492892 |
Solder bump connections |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, George J. Scott |
2013-07-23 |
| 8446006 |
Structures and methods to reduce maximum current density in a solder ball |
Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, George J. Scott +6 more |
2013-05-21 |
| 8299581 |
Passivation layer extension to chip edge |
Timothy H. Daubenspeck, Marie-Claude Paquet, Francis Santerre, Wolfgang Sauter |
2012-10-30 |
| 8298929 |
Offset solder vias, methods of manufacturing and design structures |
Timothy H. Daubenspeck, Gary LaFontant, David L. Questad, George J. Scott, Krystyna W. Semkow +3 more |
2012-10-30 |
| 7888263 |
Cladded silver and silver alloy metallization for improved adhesion electromigration resistance |
Terry L. Alford |
2011-02-15 |
| 7446037 |
Cladded silver and silver alloy metallization for improved adhesion and electromigration resistance |
Terry L. Alford |
2008-11-04 |
