Issued Patents All Time
Showing 76–100 of 153 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8299611 | Ball-limiting-metallurgy layers in solder ball structures | Charles L. Arvin, Timothy H. Daubenspeck, Wolfgang Sauter | 2012-10-30 |
| 8298904 | Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture | Joseph M. Lukaitis, Jed H. Rankin, Robert R. Robison, Dustin K. Slisher | 2012-10-30 |
| 8288270 | Enhanced electromigration resistance in TSV structure and design | Mukta G. Farooq, John A. Griesemer, Gary LaFontant, William Francis Landers | 2012-10-16 |
| 8288747 | Optoelectronic memory devices | Fen Chen, Richard S. Kontra, Tom C. Lee, Theodore M. Levin, Christopher D. Muzzy | 2012-10-16 |
| 8264078 | Metal wiring structures for uniform current density in C4 balls | Timothy H. Daubenspeck, Wolfgang Sauter, Steven L. Wright, Edmund J. Sprogis | 2012-09-11 |
| 8242012 | Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2012-08-14 |
| 8237279 | Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2012-08-07 |
| 8237288 | Enhanced electromigration resistance in TSV structure and design | Mukta G. Farooq, John A. Griesemer, Gary LaFontant, William Francis Landers | 2012-08-07 |
| 8212357 | Combination via and pad structure for improved solder bump electromigration characteristics | Timothy H. Daubenspeck, Jeffrey P. Gambino | 2012-07-03 |
| 8207609 | Optically transparent wires for secure circuits and methods of making same | Stephen P. Ayotte, Jeffrey P. Gambino, Kimball M. Watson | 2012-06-26 |
| 8198133 | Structures and methods to improve lead-free C4 interconnect reliability | Timothy H. Daubenspeck, Paul F. Fortier, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad +1 more | 2012-06-12 |
| 8159067 | Underfill flow guide structures | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Marie-Claude Paquet, Wolfgang Sauter | 2012-04-17 |
| 8138099 | Chip package solder interconnect formed by surface tension | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2012-03-20 |
| 8138602 | Solder interconnect pads with current spreading layers | Timothy H. Daubenspeck | 2012-03-20 |
| 8120131 | Array of alpha particle sensors | Ethan H. Cannon, Michael J. Hauser | 2012-02-21 |
| 8114768 | Electromigration resistant via-to-line interconnect | Baozhen Li, Paul S. McLaughlin | 2012-02-14 |
| 8110875 | Structure for charge dissipation during fabrication of integrated circuits and isolation thereof | John J. Ellis-Monaghan, Jeffrey P. Gambino, Steven H. Voldman | 2012-02-07 |
| 8084864 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy +2 more | 2011-12-27 |
| 8084858 | Metal wiring structures for uniform current density in C4 balls | Timothy H. Daubenspeck, Wolfgang Sauter, Steven L. Wright, Edmund J. Sprogis | 2011-12-27 |
| 8018017 | Thermo-mechanical cleavable structure | Fen Chen, Cathryn J. Christiansen, Richard S. Kontra, Tom C. Lee, Alvin W. Strong +1 more | 2011-09-13 |
| 8017514 | Optically transparent wires for secure circuits and methods of making same | Stephen P. Ayotte, Jeffrey P. Gambino, Kimball M. Watson | 2011-09-13 |
| 8003536 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy +2 more | 2011-08-23 |
| 7985671 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-07-26 |
| 7890893 | Design structure for semiconductor on-chip repair scheme for negative bias temperature instability | Ronald J. Bolam, Tom C. Lee | 2011-02-15 |
| 7875854 | Design structure for alpha particle sensor in SOI technology and structure thereof | Ethan H. Cannon, Michael J. Hauser | 2011-01-25 |