Issued Patents All Time
Showing 101–125 of 153 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7871919 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-01-18 |
| 7868453 | Solder interconnect pads with current spreading layers | Timothy H. Daubenspeck | 2011-01-11 |
| 7861204 | Structures including integrated circuits for reducing electromigration effect | Anthony K. Stamper, Ping-Chuan Wang | 2010-12-28 |
| 7843062 | Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature | Fen Chen, Cathryn J. Christiansen, Michael A. Shinosky | 2010-11-30 |
| 7838958 | Semiconductor on-chip repair scheme for negative bias temperature instability | Ronald J. Bolam, Tom C. Lee | 2010-11-23 |
| 7768815 | Optoelectronic memory devices | Fen Chen, Richard S. Kontra, Tom C. Lee, Theodore M. Levin, Christopher D. Muzzy | 2010-08-03 |
| 7741722 | Through-wafer vias | Paul S. Andry, Edmund J. Sprogis, Kenneth J. Stein, Cornelia K. Tsang, Ping-Chuan Wang +1 more | 2010-06-22 |
| 7709401 | Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature | Fen Chen, Cathryn J. Christiansen, Michael A. Shinosky | 2010-05-04 |
| 7692439 | Structure for modeling stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2010-04-06 |
| 7667328 | Integration circuits for reducing electromigration effect | Anthony K. Stamper, Ping-Chuan Wang | 2010-02-23 |
| 7649262 | Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing | Jonathan D. Chapple-Sokol, Terence B. Hook, Baozhen Li, Thomas L. McDevitt, Christopher A. Ponsolle +2 more | 2010-01-19 |
| 7639032 | Structure for monitoring stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2009-12-29 |
| 7601602 | Trench type buried on-chip precision programmable resistor | John M. Aitken, Fen Chen | 2009-10-13 |
| 7572650 | Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing | Jonathan D. Chapple-Sokol, Terence B. Hook, Baozhen Li, Thomas L. McDevitt, Christopher A. Ponsolle +2 more | 2009-08-11 |
| 7550730 | Method for detecting alpha particles in SOI technology | Ethan H. Cannon, Michael J. Hauser | 2009-06-23 |
| 7512506 | IC chip stress testing | Oliver Aubel, Tom C. Lee, Deborah M. Massey, Travis S. Merrill, Stanley W. Polchlopek +1 more | 2009-03-31 |
| 7511378 | Enhancement of performance of a conductive wire in a multilayered substrate | Jason P. Gill, David L. Harmon, Deborah M. Massey, Alvin W. Strong, Junichi Furukawa | 2009-03-31 |
| 7500208 | Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime | Fen Chen, Jeffrey P. Gambino, Jason P. Gill, Baozhen Li | 2009-03-03 |
| 7470613 | Dual damascene multi-level metallization | Birendra Agarwala, Eric M. Coker, Anthony Correale, Jr., Hazara S. Rathore, Richard A. Wachnik | 2008-12-30 |
| 7445966 | Method and structure for charge dissipation during fabrication of integrated circuits and isolation thereof | John J. Ellis-Monaghan, Jeffrey P. Gambino, Steven H. Voldman | 2008-11-04 |
| 7397260 | Structure and method for monitoring stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2008-07-08 |
| 7231617 | Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits | Fen Chen, Jeffrey P. Gambino, Jason P. Gill, Baozhen Li | 2007-06-12 |
| 7224063 | Dual-damascene metallization interconnection | Birendra Agarwala, Eric M. Coker, Anthony Correale, Jr., Hazara S. Rathore, Richard A. Wachnik | 2007-05-29 |
| 7212091 | Micro-electro-mechanical RF switch | Panayotis Andricacos, L. Paivikki Buchwalter, Hariklia Deligianni, Robert A. Groves, Christopher V. Jahnes +4 more | 2007-05-01 |
| 7173338 | Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing | Jonathan D. Chapple-Sokol, Terence B. Hook, Baozhen Li, Thomas L. McDevitt, Christopher A. Ponsolle +2 more | 2007-02-06 |